公开(公告)号：US10381034B2

公开(公告)日：2019-08-13

申请号：US14533487

申请日：2014-11-05

Applicant: SHOWA DENKO K.K.

Inventor： Seiya Nagai ,  Satoru Ueno

IPC: G11B5/85 ,  C23C14/56 ,  C23C14/58 ,  G11B5/851

Abstract: Provided is an in-line type film forming apparatus including a processing chamber which is disposed to deviate from a closed path and is connected to a corner chamber, a first loading and unloading unit which unloads a substrate from a carrier and moves the substrate to the inside of the processing chamber, a second loading and unloading unit which unloads the substrate processed in the processing chamber and loads the substrate on the carrier, and a control device which performs control of driving the first and second loading and unloading units to unload the substrate from the carrier and to move the substrate to the inside of the processing chamber, and to take out the substrate processed in the processing chamber in advance from the processing chamber and to load the substrate on the carrier.