公开(公告)号：US20230066239A1

公开(公告)日：2023-03-02

申请号：US17981060

申请日：2022-11-04

申请人： SHOWA DENKO MATERIALS CO., LTD.

发明人： Atsushi TAKAHASHI

IPC分类号： C08L79/08 ,  C09D127/18 ,  C09D127/20 ,  C09D179/08 ,  C08K5/357 ,  C08G73/14

摘要： A polyamideimide resin composition containing a polyamideimide resin (A), 4-morpholine carbaldehyde (B), water (C), and a basic compound (D), wherein the change in viscosity of the composition from before storage to after storage at 60° C. for 7 days is within −30%.

公开(公告)号：US20220228028A1

公开(公告)日：2022-07-21

申请号：US17610980

申请日：2019-05-16

申请人： Showa Denko Materials Co., Ltd.

发明人： Yasuyuki SAITO ,  Atsushi TAKAHASHI ,  Rei SATAKE

IPC分类号： C09D179/08 ,  C09D7/63 ,  C08L79/08 ,  C08G73/14

摘要： A polyamideimide resin composition comprises a polyamideimide resin and a solvent containing a compound represented by formula (1). In the formula, R1 represents an alkyl group of 1 to 8 carbon atoms, R2 and R3 each independently represent a hydrogen atom or an alkyl group of 1 to 8 carbon atoms, and X represents an alkylene group of 1 to 8 carbon atoms.