公开(公告)号：US20200215795A1

公开(公告)日：2020-07-09

申请号：US16647285

申请日：2018-06-28

Applicant: SHOWA DENKO PACKAGING CO.,LTD.

Inventor： Kenji YOSHINO ,  Yuji MINAMIBORI ,  Katsumi TANAKA

IPC: B32B15/09 ,  B32B27/36 ,  H01M2/02 ,  B32B7/12 ,  C09J175/06 ,  B32B15/20

Abstract: Provided is a molding packaging material capable of sealing without causing sealing failure, significantly reducing cleaning frequency of a seal bar to improve productivity, and preventing occurrence of delamination. The molding packaging material includes a PBT terephthalate (PBT) layer 2, a heat fusible resin layer 3, and a metal foil layer 4 between the two layers. The PBT layer 2 and the metal foil layer 4 are bonded via an outer adhesive layer 5. The outer adhesive layer 5 is formed of a urethane adhesive cured film composed of a polyester polyol, a polyfunctional isocyanate compound, and polyhydric alcohol. The polyester polyol contains a dicarboxylic acid component, the dicarboxylic acid component includes an aromatic dicarboxylic acid. The dicarboxylic acid component contains an aromatic dicarboxylic acid. The content rate of the aromatic dicarboxylic acid in the dicarboxylic acid component is 40 mol % to 80 mol %. The Young's modulus of the cured film of the urethane adhesive is 70 MPa to 400 MPa. The PBT layer has tensile strength of 100 MPa to 300 MPa.