公开(公告)号：US20240352222A1

公开(公告)日：2024-10-24

申请号：US18685533

申请日：2022-08-31

申请人： SHPP GLOBAL TECHNOLOGIES B.V.

发明人： Yinlong Du ,  Shijie Song ,  Yapeng Fang

IPC分类号： C08K3/22 ,  C08K7/14 ,  C08L71/12 ,  C08L81/02 ,  H01Q1/36

CPC分类号： C08K3/22 ,  C08K7/14 ,  C08L71/123 ,  C08L81/02 ,  H01Q1/364 ,  C08K2003/2237 ,  C08K2003/2241 ,  C08K2201/005

摘要： Disclosed is a composition comprising from about 15 wt. % to about 80 wt. % of a thermoplastic resin, wherein the thermoplastic resin comprises a polyphenylene sulfide or a polyether ketone or a combination thereof; and from about 10 wt. % to 80 wt. % of a ceramic filler, wherein the ceramic filler comprises (a) an oxide of titanium, barium, calcium, magnesium, or copper, or strontium or a combination thereof, or (b) a titanate of calcium, magnesium, titanium, or copper or a combination thereof, and wherein the ceramic filler has a particle size of from about 0.1 μm to about 10 μm, wherein the composition exhibits a dielectric constant greater than 4, wherein the composition exhibits a dissipation factor less than 0.005 at 1.9 GHz, and wherein the combined weight percent value of all components does not exceed 100 wt. %, and all weight percent values are based on the total weight of the composition.