公开(公告)号：US12128493B2

公开(公告)日：2024-10-29

申请号：US16981777

申请日：2019-02-27

申请人： ACR II GLASS AMERICA INC.

发明人： Olivier Farreyrol

IPC分类号： B23K1/00 ,  B23K35/26 ,  C22C13/00 ,  H01R4/62 ,  H01R12/53 ,  H01R12/57 ,  H01R43/02 ,  H05B3/84 ,  H01Q1/12 ,  H01Q1/36

CPC分类号： B23K1/0008 ,  B23K35/262 ,  C22C13/00 ,  H01R4/625 ,  H01R12/53 ,  H01R12/57 ,  H01R43/02 ,  H05B3/84 ,  H01Q1/1278 ,  H01Q1/364 ,  H05B2203/016 ,  H05B2203/017

摘要： A method of producing a vehicle glass assembly includes (A) providing a harness including a metal wire, a connector at a terminal of the metal wire, including a flat portion made of a metal plate, and a block of lead-free solder, containing tin as a major component, soldered on the flat portion of the connector; (B) providing a glass substrate layer over which a conductive layer, including an electrically conductive wire pattern and a connecting terminal, is formed; (C) sandwiching the block between the flat portion of the connector and the connecting terminal of the conductive layer, and then melting the block to form a solder connection between the connector and the connecting terminal; wherein the amount of the lead-free solder is between 4 mg and 13 mg.

公开(公告)号：US20240352222A1

公开(公告)日：2024-10-24

申请号：US18685533

申请日：2022-08-31

申请人： SHPP GLOBAL TECHNOLOGIES B.V.

发明人： Yinlong Du ,  Shijie Song ,  Yapeng Fang

IPC分类号： C08K3/22 ,  C08K7/14 ,  C08L71/12 ,  C08L81/02 ,  H01Q1/36

CPC分类号： C08K3/22 ,  C08K7/14 ,  C08L71/123 ,  C08L81/02 ,  H01Q1/364 ,  C08K2003/2237 ,  C08K2003/2241 ,  C08K2201/005

摘要： Disclosed is a composition comprising from about 15 wt. % to about 80 wt. % of a thermoplastic resin, wherein the thermoplastic resin comprises a polyphenylene sulfide or a polyether ketone or a combination thereof; and from about 10 wt. % to 80 wt. % of a ceramic filler, wherein the ceramic filler comprises (a) an oxide of titanium, barium, calcium, magnesium, or copper, or strontium or a combination thereof, or (b) a titanate of calcium, magnesium, titanium, or copper or a combination thereof, and wherein the ceramic filler has a particle size of from about 0.1 μm to about 10 μm, wherein the composition exhibits a dielectric constant greater than 4, wherein the composition exhibits a dissipation factor less than 0.005 at 1.9 GHz, and wherein the combined weight percent value of all components does not exceed 100 wt. %, and all weight percent values are based on the total weight of the composition.

公开(公告)号：US20240195053A1

公开(公告)日：2024-06-13

申请号：US18326040

申请日：2023-05-31

申请人： Nantong University ,  Nantong Research Institute for Advanced Communication Technologies Co.,Ltd.

发明人： Mei Yu ,  Jin Shi ,  Yongjie Yang ,  Kai Xu

IPC分类号： H01Q1/36 ,  H01P1/02 ,  H01Q21/00

CPC分类号： H01Q1/364 ,  H01P1/02 ,  H01Q21/0006

摘要： A meander embedding sector traveling-wave antenna for series superconducting detectors is provided, including: a detector array, a meander metal layer, a pair of bend-line metal layers, and a pair of sector metal layers. The detector array is individually connected in the meander metal layer and the pair of bend-line metal layers; the pair of bend-line metal layers is correspondingly connected to the pair of sector metal layers; and the pair of sector metal layers is disposed symmetrically centered on the detector array. The antenna improves working bandwidth of THz antenna and completes low-impedance matching between a single antenna and each series Josephson junction embedded in the antenna. The embedding meander can be connected to a plurality of low-impedance detectors, and performance of the antenna is not influenced while target impedance matching is completed. And the working bandwidth of the THz antenna embedded with the series detectors is increased.

公开(公告)号：US11984653B2

公开(公告)日：2024-05-14

申请号：US17449073

申请日：2021-09-27

申请人： Microsoft Technology Licensing, LLC

发明人： Jouya Jadidian ,  Erik Alan Holverson ,  Ruben Caballero

IPC分类号： H01Q1/27 ,  H01Q1/36 ,  H01Q1/38

CPC分类号： H01Q1/364 ,  H01Q1/273 ,  H01Q1/38

摘要： Examples are disclosed related to optically transparent antennas. One example provides a device, comprising an electrically insulating substrate that is at least partially optically transparent, one or more antennas disposed on the electrically insulating substrate, each antenna comprising a film of a conductive material that is at least partially optically transparent, the one or more antennas comprising a communication antenna, and processing circuitry electrically coupled to the communication antenna, the processing circuitry configured to one or more of send or receive signals via the communication antenna.

公开(公告)号：US20240150549A1

公开(公告)日：2024-05-09

申请号：US18547226

申请日：2022-02-21

申请人： RESONAC CORPORATION

发明人： Daisuke OTSUKI ,  Masato MIYATAKE ,  Shigeru KOIBUCHI ,  Takeshi NOJIRI

IPC分类号： C08K5/092 ,  C08K5/10 ,  H01Q1/36 ,  H01Q1/38

CPC分类号： C08K5/092 ,  C08K5/10 ,  H01Q1/364 ,  H01Q1/38

摘要： A resin composition, containing: an elastomer; a methacrylic compound; and a thermal polymerization initiator. A cured product of the resin composition. A laminate having: a base material film; and a transparent resin layer disposed on the base material film, in which the transparent resin layer contains the resin composition or the cured product. A transparent antenna 110, having: a transparent base material 110a; and a mesh-shaped conductive member 110b disposed on the transparent base material 110a, in which the transparent base material 110a contains the cured product. An image display device 100 has the transparent antenna 110.

公开(公告)号：US11955692B2

公开(公告)日：2024-04-09

申请号：US17515315

申请日：2021-10-29

申请人： Texas Instruments Incorporated

发明人： Juan Alejandro Herbsommer

IPC分类号： H01Q1/22 ,  H01Q1/36 ,  H01Q1/46 ,  H01Q9/06

CPC分类号： H01Q1/2283 ,  H01Q1/364 ,  H01Q1/46 ,  H01Q9/065

摘要： A described example includes: a semiconductor die mounted to a die pad of a package substrate, the semiconductor die having bond pads on a device side surface facing away from the die pad; bond wires coupling the bond pads of the semiconductor die to leads of the package substrate, the leads spaced from the die pad; an antenna positioned over the device side surface of the semiconductor die and having a feed line coupled between the antenna and a device side surface of the semiconductor die; and mold compound covering the semiconductor die, the bond wires, a portion of the leads, and the die side surface of the die pad, a portion of the antenna exposed from the mold compound.

公开(公告)号：US11901623B2

公开(公告)日：2024-02-13

申请号：US17405661

申请日：2021-08-18

申请人： Georgia Tech Research Corporation

发明人： Xuanke He ,  Emmanouil Tentzeris ,  Ryan Alexander Bahr ,  Yunnan Fang

IPC分类号： H01Q1/22 ,  H01Q13/02 ,  H01Q13/18 ,  H01Q1/36

CPC分类号： H01Q13/0233 ,  H01Q1/2283 ,  H01Q1/364 ,  H01Q13/18

摘要： An antenna system includes an antenna waveguide having a waveguide surface. A set of printed electronics includes conductors deposited onto the waveguide surface of the antenna waveguide. The system further includes at least one transceiver integrated circuit (IC), the transceiver integrated circuit having a surface assembly, wherein the surface assembly is adhesively coupled to the antenna waveguide and directly connected to the waveguide surface of the antenna waveguide.

公开(公告)号：US11855342B2

公开(公告)日：2023-12-26

申请号：US17986664

申请日：2022-11-14

申请人： Duke University

发明人： Insang Yoo ,  Seyedmohammadreza Faghih Imani ,  Timothy Sleasman ,  David R. Smith

IPC分类号： H01Q1/36 ,  H01Q5/30 ,  H01Q21/00 ,  H04B7/0413 ,  H01Q21/06 ,  H01Q1/52 ,  H01Q15/00 ,  H01Q21/28 ,  H01Q25/00 ,  H04B7/06 ,  H04B7/08 ,  H04B7/10

CPC分类号： H01Q1/364 ,  H01Q1/523 ,  H01Q5/30 ,  H01Q15/0086 ,  H01Q21/0025 ,  H01Q21/062 ,  H01Q21/28 ,  H01Q25/00 ,  H04B7/0413 ,  H04B7/0617 ,  H04B7/0837 ,  H04B7/10

摘要： A MIMO communication system is provided. The system may include a first antenna comprising a first cavity, a first plurality of RF ports for generating a feed wave within the first cavity, and a first plurality of sub-wavelength artificially structured material elements as arranged on a surface of the first cavity as RF radiators. The first antenna is configured to generate a plurality of radiation patterns respectively corresponding to the first plurality of ports. The system may also include a second antenna comprising a second cavity and a second plurality of sub-wavelength artificially structured material elements arranged on a surface of the second cavity.

公开(公告)号：US20230369773A1

公开(公告)日：2023-11-16

申请号：US18359650

申请日：2023-07-26

申请人： University of Florida Research Foundation, Inc.

发明人： Jennifer S. Andrew ,  Matthew Bauer ,  David P. Arnold

IPC分类号： H01Q15/00 ,  H01Q1/36 ,  H01Q21/06

CPC分类号： H01Q15/0086 ,  H01Q1/364 ,  H01Q21/061

摘要： Embodiments of the present disclosure integrate magnetoelectric nanowire arrays within antenna assemblies to form ultra-compact antennas. An exemplary method comprises using a dielectrophoretic force to orient a magnetoelectric nanowire across an electrode gap separating a pair of electrodes; and transmitting or receiving electromagnetic waves through a magnetoelectric effect of the magnetoelectric nanowire. Other methods, apparatuses, and systems are also presented.

公开(公告)号：US11805597B2

公开(公告)日：2023-10-31

申请号：US16817176

申请日：2020-03-12

申请人： Carnegie Mellon University

发明人： O Burak Ozdoganlar ,  Carmel Majidi ,  Kadri Bugra Ozutemiz ,  James Wissman

IPC分类号： H05K3/12 ,  H05K1/02 ,  H01L23/498 ,  H01Q1/36 ,  H05K3/38 ,  H01L21/48

CPC分类号： H05K1/0283 ,  H01L21/4846 ,  H01L23/4985 ,  H01Q1/364 ,  H05K3/1208 ,  H05K3/1216 ,  H05K3/1241 ,  H05K3/1258 ,  H05K3/388

摘要： A high-throughput method of manufacturing a liquid metal circuit may include applying a liquid metal to an alloying metal pattern on an elastic substrate to form the liquid metal circuit. The elastic substrate may have a surface area greater than 1 square inch. The liquid metal circuit may include a plurality of liquid metal circuits on the elastic substrate. Methods of using the liquid metal circuit are also described.