公开(公告)号：US11773294B2

公开(公告)日：2023-10-03

申请号：US17422487

申请日：2020-03-19

Applicant: SIKA TECHNOLOGY AG

Inventor： Marcel Oertli ,  Robert Roskamp ,  Helena Wallimann ,  Christoph Fäh ,  Fabien Choffat

IPC: C09J5/00 ,  B32B7/12 ,  B32B25/04 ,  B32B37/12 ,  C08J5/12 ,  C09J11/06 ,  C09J11/08 ,  B32B38/00

CPC classification number: C09J5/00 ,  B32B7/12 ,  B32B25/042 ,  B32B37/12 ,  C08J5/124 ,  C09J11/06 ,  C09J11/08 ,  B32B2037/1261 ,  B32B2038/0056 ,  B32B2250/02 ,  B32B2250/248 ,  C08J2323/16 ,  C08J2375/08 ,  C08J2400/26 ,  C09J2301/41 ,  C09J2415/006 ,  C09J2421/006 ,  C09J2423/006 ,  C09J2471/00 ,  C09J2475/00

Abstract: A method for adhesively bonding two substrates by means of a moisture-curable adhesive composition, wherein at least one of the substrates includes at least 40 wt.-% of a mixture, said mixture consisting of: between 15 and 99 wt.-% of at least one thermoplastic polymer; between 1 and 85 wt.-% of at least one elastomer; and wherein the moisture-curable adhesive composition includes: at least one polymer containing silane groups; between 10 and 40 wt.-% of at least one polymeric plasticizer; between 0.1 and 5 wt.-% of at least one amino-functional alkoxysilane; between 0 and 5 wt.-% of at least one C1-C12-alkyl-functional alkoxysilane. The method yields adhesively bonded substrates without the requirements of using migrating plasticizers and pre-treating of the substrates.