公开(公告)号：US20220225493A1

公开(公告)日：2022-07-14

申请号：US17465335

申请日：2021-09-02

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ming-Fan Tsai ,  Chih-Wei Chen ,  Chien-Cheng Lin ,  Chao-Ya Yang ,  Chia-Yang Chen

IPC: H05K1/02

Abstract: An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.

公开(公告)号：US11723144B2

公开(公告)日：2023-08-08

申请号：US17465335

申请日：2021-09-02

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ming-Fan Tsai ,  Chih-Wei Chen ,  Chien-Cheng Lin ,  Chao-Ya Yang ,  Chia-Yang Chen

IPC: H05K1/02

CPC classification number: H05K1/0225 ,  H05K2201/10098

Abstract: An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.

公开(公告)号：US11764162B2

公开(公告)日：2023-09-19

申请号：US16997173

申请日：2020-08-19

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ming-Fan Tsai ,  Chih-Wei Chen ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Chia-Yang Chen

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2924/3025

Abstract: An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.

公开(公告)号：US20210210435A1

公开(公告)日：2021-07-08

申请号：US16997173

申请日：2020-08-19

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ming-Fan Tsai ,  Chih-Wei Chen ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Chia-Yang Chen

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

Abstract: An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.