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公开(公告)号：US20240266197A1
公开(公告)日：2024-08-08
申请号：US18323741
申请日：2023-05-25
发明人： Tang-Hsin KUO , Chin-Chih HSIAO , Hung-Wen CHIEN , I HSU
IPC分类号： H01L21/677 , H01L21/67 , H01L21/687
CPC分类号： H01L21/6773 , H01L21/67173 , H01L21/67196 , H01L21/67769 , H01L21/67778 , H01L21/68707
摘要： A working system for a semiconductor packaging process includes a machine equipment, a supply unit and a return device. The supply unit is correspondingly connected to the machine equipment and includes an input device and an output device. The return device is connected to the input device and the output device. As such, a magazine is transferred from the input device to the output device via the return device, thereby accelerating the operation speed of a production line.
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公开(公告)号：US20240266193A1
公开(公告)日：2024-08-08
申请号：US18324198
申请日：2023-05-26
发明人： Tang-Hsin KUO , Chin-Chih HSIAO , Hung-Wen CHIEN , I HSU
IPC分类号： H01L21/67 , H01L21/677
CPC分类号： H01L21/67121 , H01L21/67769 , H01L21/67775 , H01L21/67778
摘要： A working system for a semiconductor packaging process includes a machine equipment and a supply unit correspondingly connected to the machine equipment, and the supply unit includes an input device, an output device and a pick-and-place device for inputting a magazine to the input device and/or outputting the magazine from the output device, so that the magazine is automatically transported to the input device or away from the output device by the pick-and-place device, thereby accelerating the operation speed of the production line.
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