公开(公告)号：US20230268262A1

公开(公告)日：2023-08-24

申请号：US17750931

申请日：2022-05-23

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Li-Chu Chang ,  Yuan-Hung Hsu ,  Don-Son Jiang

IPC: H01L23/498 ,  H01L25/065 ,  H01L21/48 ,  H01L23/48

CPC classification number: H01L23/49833 ,  H01L25/0655 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/481 ,  H01L24/16

Abstract: A method of manufacturing an electronic package is provided and includes disposing a circuit member and a plurality of electronic elements on opposite sides of a carrier structure having circuit layers respectively, so that any two of the plurality of electronic elements can be electrically connected to each other via the circuit layers and the circuit member, where a vertical projected area of the carrier structure is larger than a vertical projected area of the circuit member, such that the circuit member is free from being protruded from side surfaces of the carrier structure. Therefore, the circuit member replaces a part of circuit layers of the carrier structure to reduce the difficulty of fabricating the circuit layers in the carrier structure.