公开(公告)号：US20230136541A1

公开(公告)日：2023-05-04

申请号：US17568913

申请日：2022-01-05

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： You-Chen Lin ,  Yu-Min Lo ,  Kuo-Hua Yu ,  Jun-Hao Feng

IPC: H01L23/538 ,  H01L21/48

Abstract: An electronic package is provided and includes a protection layer formed on the electronic structure having a plurality of conductors to cover the plurality of conductors, a dielectric layer having a plurality of grooves to enable the electronic structure to be bonded onto one side of the dielectric layer with the protection layer thereon such that each of the plurality of conductors is correspondingly accommodated in each of the plurality of grooves, and a plurality of conductive components disposed on another side of the dielectric layer. Accordingly, the design of the grooves is used to correspond to the high and low surfaces of the electronic structure such that the problem of poor manufacturing process can be avoided.

公开(公告)号：US12132003B2

公开(公告)日：2024-10-29

申请号：US17568913

申请日：2022-01-05

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： You-Chen Lin ,  Yu-Min Lo ,  Kuo-Hua Yu ,  Jun-Hao Feng

IPC: H01L23/538 ,  H01L21/48 ,  H01L23/48 ,  H01L25/065

CPC classification number: H01L23/5383 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/5381 ,  H01L23/481 ,  H01L25/0655

Abstract: An electronic package is provided and includes a protection layer formed on the electronic structure having a plurality of conductors to cover the plurality of conductors, a dielectric layer having a plurality of grooves to enable the electronic structure to be bonded onto one side of the dielectric layer with the protection layer thereon such that each of the plurality of conductors is correspondingly accommodated in each of the plurality of grooves, and a plurality of conductive components disposed on another side of the dielectric layer. Accordingly, the design of the grooves is used to correspond to the high and low surfaces of the electronic structure such that the problem of poor manufacturing process can be avoided.