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公开(公告)号:US20220161390A1
公开(公告)日:2022-05-26
申请号:US17199163
申请日:2021-03-11
申请人: SK SILTRON CO., LTD.
发明人: Ji Hwan CHO
IPC分类号: B24B53/017 , B24B53/00
摘要: An apparatus of cleaning a polishing pad includes: a first gas nozzle for spraying gas onto the pores of the polishing pad; and a first liquid nozzle for spraying a liquid to the pores of the polishing pad.