公开(公告)号：US12125721B2

公开(公告)日：2024-10-22

申请号：US17730588

申请日：2022-04-27

申请人： SKY TECH INC.

发明人： Jing-Cheng Lin ,  Jung-Hua Chang ,  Mao-Chan Chang

IPC分类号： H01L21/67

CPC分类号： H01L21/67132

摘要： A parallelism-adjustable bonding machine includes a first chamber, a second chamber, a press-bonding unit, a carrier and plural parallelism-adjusting units. The first chamber is configured to connect to the second chamber, so as to define a closed space therebetween. The press-bonding unit is disposed within the first chamber, and the carrier is disposed within the second chamber. The press-bonding unit is disposed to face the carrier configured to press and bond substrates placed on the carrier. Each of the parallelism-adjusting units is disposed on the first chamber, and includes an adjustment shaft extending through the first chamber and connected to the press-bonding unit. The adjustment shaft includes an adjustment member located outside the first chamber and the closed space. A user is able to adjust a parallelism between the press-bonding unit and the carrier in an efficient and precise manner, from the adjustment member.

公开(公告)号：US11961753B2

公开(公告)日：2024-04-16

申请号：US17548297

申请日：2021-12-10

申请人： SKY TECH INC.

发明人： Jing-Cheng Lin ,  Jung-Hua Chang ,  Mao-Chan Chang

IPC分类号： H01L21/68 ,  H01L21/67

CPC分类号： H01L21/68 ,  H01L21/67132

摘要： A substrate-bonding device includes a carrier, three first aligning units, three second aligning units, a pressing plate, and two flat-edge aligners. A carrying surface of the carrier is provided with a placement area for placing a first substrate provided with a flat edge thereon. The first aligning units, the second aligning units and the flat edge aligners are disposed around the placement area. The first aligning units are configured to align the first substrate and to support a second substrate provided with a second flat edge. The second aligning units are configured to align the second substrate. The flat edge aligners are configured to contact the first and the second flat edges, to position and align the first and the second substrates. The pressing plate is disposed to face the placement area for pressing the first and second substrates. The flat edge aligners move along with the pressing plate.