公开(公告)号：US11199051B2

公开(公告)日：2021-12-14

申请号：US16153865

申请日：2018-10-08

Applicant: Smith International, Inc.

Inventor： Yi Fang ,  J. Daniel Belnap ,  Scott L. Horman ,  Ryan Davis ,  Haibo Zhang

IPC: E21B10/567 ,  E21B10/08

Abstract: A cutting element has an intercrystalline-bonded diamond body that includes an inner region and an outer surface that includes a working surface of the cutting element. The outer surface is treated, after formation of the intercrystalline-bonded diamond by high-pressure/high-temperature process, to have a level of surface compressive stress that is greater than a compressive stress of the inner region.

公开(公告)号：US10100583B2

公开(公告)日：2018-10-16

申请号：US14475311

申请日：2014-09-02

Applicant: SMITH INTERNATIONAL, INC.

Inventor： Yi Fang ,  J. Daniel Belnap ,  Scott L. Horman ,  Ryan Davis ,  Haibo Zhang

IPC: E21B10/56 ,  E21B10/46 ,  B24D99/00 ,  B24D3/10 ,  B24D18/00

Abstract: Cutting elements include polycrystalline diamond which may be attached to a substrate. The polycrystalline diamond may have a ratio of cubic to hexagonal cobalt crystalline structures of greater than about 1.2. The polycrystalline diamond may have a high level surface compressive stress of greater than about 500 MPa.

公开(公告)号：US20190040688A1

公开(公告)日：2019-02-07

申请号：US16153865

申请日：2018-10-08

Applicant: Smith International, Inc.

Inventor： Yi Fang ,  J. Daniel Belnap ,  Scott L. Horman ,  Ryan Davis ,  Haibo Zhang

IPC: E21B10/567 ,  E21B10/08

Abstract: A cutting element has an intercrystalline-bonded diamond body that includes an inner region and an outer surface that includes a working surface of the cutting element. The outer surface is treated, after formation of the intercrystalline-bonded diamond by high-pressure/high-temperature process, to have a level of surface compressive stress that is greater than a compressive stress of the inner region.