摘要:
A method of forming a polycrystalline diamond cutting element includes assembling a diamond material, a substrate, and a source of catalyst material or infiltrant material distinct from the substrate, the source of catalyst material or infiltrant material being adjacent to the diamond material to form an assembly. The substrate includes an attachment material including a refractory metal. The assembly is subjected to a first high-pressure/high temperature condition to cause the catalyst material or infiltrant material to melt and infiltrate into the diamond material and subjected to a second high-pressure/high temperature condition to cause the attachment material to melt and infiltrate a portion of the infiltrated diamond material to bond the infiltrated diamond material to the substrate.
摘要:
A cutting element may include: a substrate; and an ultrahard layer on the substrate, the ultrahard layer having a non-planar working surface, the non-planar working surface being formed from a first region and a second region, the first region, encompassing at least a cutting edge or tip of the cutting element and having a differing composition than the second region.
摘要:
A method for forming a diamond body includes placing a thermally stable polycrystalline diamond body and a first substrate into an enclosure, the thermally stable polycrystalline diamond body comprising a plurality of bonded diamond crystals and a plurality of interstitial regions between the bonded diamond crystals, the interstitial regions being substantially free of a catalyst material, heating the thermally stable polycrystalline diamond body and the first substrate to remove residual materials from the thermally stable polycrystalline diamond body, subjecting the thermally stable polycrystalline diamond body and the first substrate to a vacuum for evacuating such residual material, and pressing under high temperature the enclosure, the thermally stable polycrystalline diamond body and the first substrate while maintaining a vacuum in the enclosure to bond the thermally stable polycrystalline diamond body to the substrate.
摘要:
An apparatus for forming a cutting insert may include a compression device having a sleeve with a bore. The sleeve may receive a substantially hollow can. Solid particulates may be positioned within the can, and a substrate material or other punch may also be positioned in the can. A forming device adjacent an end of the can in which the solid particulates are located may include at least one protrusion extending into the bore. The protrusion may be adapted to deform the can while also forming the plurality of solid particulates into a solid mass having one or more reliefs and/or lobes. A method may include pressing the solid particulates while within a can to form a solid mass having one or more reliefs or lobes. An HPHT process may be performed to bond the solid mass to a substrate material.
摘要:
An insert for a drill bit may include a metallic carbide body; an outer layer of polycrystalline diamond material on the outermost end of the insert, the polycrystalline diamond material comprising a plurality of interconnected first diamond grains and a first binder material in interstitial regions between the interconnected first diamond grains; and at least one transition layer between the metallic carbide body and the outer layer, the at least one transition layer comprising a composite of second diamond grains, first metal carbide particles, and a second binder material, wherein the first metal carbide particles form a matrix in which the second diamond grains are dispersed, wherein the first metal carbide particles are present in the at least one transition layer in an amount ranging from about 15 to 50 volume percent.
摘要:
An insert for a drill bit may include a metallic carbide body; an outer layer of polycrystalline diamond material on the uppermost end of the insert, wherein the polycrystalline diamond material comprises: a plurality of interconnected diamond grains; a plurality of additive grains; a binder material; wherein the average additive grain size is smaller than the average diamond grain size.
摘要:
A cutting element has an intercrystalline-bonded diamond body that includes an inner region and an outer surface that includes a working surface of the cutting element. The outer surface is treated, after formation of the intercrystalline-bonded diamond by high-pressure/high-temperature process, to have a level of surface compressive stress that is greater than a compressive stress of the inner region.
摘要:
Cutting elements include polycrystalline diamond which may be attached to a substrate. The polycrystalline diamond may have a ratio of cubic to hexagonal cobalt crystalline structures of greater than about 1.2. The polycrystalline diamond may have a high level surface compressive stress of greater than about 500 MPa.
摘要:
A method of forming a polycrystalline diamond cutting element includes assembling a diamond material, a substrate, and a source of catalyst material or infiltrant material distinct from the substrate, the source of catalyst material or infiltrant material being adjacent to the diamond material to form an assembly. The substrate includes an attachment material including a refractory metal. The assembly is subjected to a first high-pressure/high temperature condition to cause the catalyst material or infiltrant material to melt and infiltrate into the diamond material and subjected to a second high-pressure/high temperature condition to cause the attachment material to melt and infiltrate a portion of the infiltrated diamond material to bond the infiltrated diamond material to the substrate.
摘要:
Assemblies as disclosed herein for making superhard products by HPHT process comprise a first can portion for accommodating a mixture of materials therein and a second can mated with the first can portion. A leak-tight seal is provided between the first can portion and second can portion in a manner that accommodates the manufacture of relatively longer superhard products without having to change other elements or members used for HPHT processing to thereby provide improved manufacturing flexibility and cost efficiency.