公开(公告)号：US20240376629A1

公开(公告)日：2024-11-14

申请号：US18692194

申请日：2022-09-27

Applicant: SOCPRA SCIENCES ET GENIE S.E.C.

Inventor： Philippe-Olivier PROVOST ,  Abderraouf BOUCHERIF

IPC: C25F7/00 ,  C25F3/12 ,  H01L21/306 ,  H01L21/67 ,  H01L21/683

Abstract: There is described a wafer receiver for use in an electrochemical porosification process. The wafer receiver generally has an electrode body having a first flat surface, a second flat surface opposite the first flat surface, a groove recessed from the first flat surface and running within a central region of the electrode body, a seat extending annularly around the central region of the electrode body and recessed from the first flat surface, a conduit in fluid communication with the groove and connectable to a vacuum pump; and an annular sealing element received in the seat, the annular sealing element being made of a resilient material resistant to said electrochemical porosification process, the annular sealing element having a wafer receiving surface protruding from the first flat surface when received in the scat.