公开(公告)号：US11471945B2

公开(公告)日：2022-10-18

申请号：US17031950

申请日：2020-09-25

申请人： SODICK CO., LTD.

发明人： Naoto Nakamura ,  Shuji Okazaki

IPC分类号： B22F10/00 ,  B23K37/00 ,  B22F12/20 ,  B29C64/218 ,  B22F10/10 ,  B33Y30/00 ,  B23K103/04 ,  B23K26/342 ,  B23K15/00 ,  B22F12/63 ,  B22F12/60

摘要： A lamination molding apparatus includes: a material layer forming device that forms a material layer in a molding region; an irradiator that sinters or melts the material layer to form a solidified layer; and a cooling device that cools, to a cooling temperature, at least a part including an upper surface of a solidified body. The material layer forming device includes: a base having the molding region, a recoater head disposed on the base, a recoater head driving device that reciprocates the recoater head in a horizontal direction, and a blade that is arranged on the recoater head and that levels material powder to form the material layer. The cooling device includes: a cooling body that is controlled to the cooling temperature and comes into contact with the upper surface of the solidified body, and a mounting member that mounts the cooling body to the recoater head.