公开(公告)号：US10386971B2

公开(公告)日：2019-08-20

申请号：US14910117

申请日：2014-07-23

Applicant: SONY CORPORATION

Inventor： Taizo Nishimura ,  Fumihiko Iida ,  Hiroshi Mizuno ,  Yasuyuki Abe ,  Takayuki Tanaka ,  Hayato Hasegawa ,  Shogo Shinkai

IPC: G06F3/044 ,  G06F3/041

Abstract: A sensor device includes: a sensor layer provided at a position facing a surface, of a substrate having an operation surface, opposite to the operation surface, and configured to detect a contacted position or a pressed position on the operation surface; and a gap layer located in a gap between the substrate and the sensor layer. The gap layer includes a bonding region bonding the substrate to the sensor layer, and a relaxation region relaxing stress applied from the substrate to the sensor layer.

公开(公告)号：US09785297B2

公开(公告)日：2017-10-10

申请号：US14763657

申请日：2013-12-06

Applicant: Sony Corporation

Inventor： Hiroto Kawaguchi ,  Shogo Shinkai ,  Kei Tsukamoto ,  Tomoko Katsuhara ,  Hayato Hasegawa ,  Fumihiko Iida ,  Takayuki Tanaka ,  Tomoaki Suzuki ,  Taizo Nishimura ,  Hiroshi Mizuno ,  Yasuyuki Abe

IPC: G06F3/045 ,  G06F3/044 ,  G06F3/041 ,  G06F3/047

CPC classification number: G06F3/044 ,  G06F3/0414 ,  G06F3/047 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04106

Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.

公开(公告)号：US20160202800A1

公开(公告)日：2016-07-14

申请号：US14914405

申请日：2014-08-22

Applicant: SONY CORPORATION

Inventor： Takashi Itaya ,  Shogo Shinkai ,  Hiroto Kawaguchi ,  Fumihiko Iida ,  Hayato Hasegawa ,  Kei Tsukamoto ,  Takayuki Tanaka ,  Tomoko Katsuhara ,  Tomoaki Suzuki ,  Taizo Nishimura ,  Hiroshi Mizuno ,  Yasuyuki Abe

IPC: G06F3/044 ,  G06F3/047 ,  G06F3/041

CPC classification number: G06F3/044 ,  G06F3/0414 ,  G06F3/047 ,  G06F2203/04102

Abstract: There is provided a sensor device that includes a flexible first conductor layer and an electrode substrate. The electrode substrate includes a plurality of first electrode wires, a plurality of second electrode wires, capacity sensors being formed at capacitively coupled portions of the first and second electrode wires, and a flexible substrate that supports the first and second electrode wires. The sensor device also includes a first supporting body including a plurality of first structures that connect the first conductor layer and the electrode substrate.

Abstract translation: 提供了一种传感器装置，其包括柔性第一导体层和电极基板。 电极基板包括多个第一电极线，多个第二电极线，容量传感器，形成在第一和第二电极线的电容耦合部分，以及支撑第一和第二电极线的柔性基板。 传感器装置还包括第一支撑体，其包括连接第一导体层和电极基板的多个第一结构。

公开(公告)号：US10055067B2

公开(公告)日：2018-08-21

申请号：US14774732

申请日：2014-02-06

Applicant: Sony Corporation

Inventor： Shogo Shinkai ,  Kei Tsukamoto ,  Tomoko Katsuhara ,  Hiroto Kawaguchi ,  Hayato Hasegawa ,  Fumihiko Iida ,  Takayuki Tanaka ,  Tomoaki Suzuki ,  Taizo Nishimura ,  Hiroshi Mizuno ,  Yasuyuki Abe

IPC: G06F3/045 ,  G06F3/044 ,  G06F3/0354 ,  G06F3/041

CPC classification number: G06F3/044 ,  G06F3/03547 ,  G06F3/0416 ,  G06F2203/04104 ,  G06F2203/04112

Abstract: [Object] To provide a sensor device capable of detecting an operation position and a pressing force with high accuracy.[Solution] A sensor device includes a first conductor layer, an electrode substrate, and a plurality of first structural bodies configured to separate the first conductor layer from the electrode substrate. At least one of the first conductor layer and the electrode substrate has flexibility. The electrode substrate includes a plurality of first electrodes and a plurality of second electrodes intersecting the plurality of first electrodes. At least one of the first and second electrodes includes a plurality of sub-electrodes.

公开(公告)号：US20160179248A1

公开(公告)日：2016-06-23

申请号：US14910117

申请日：2014-07-23

Applicant: SONY CORPORATION

Inventor： Taizo Nishimura ,  Fumihiko Iida ,  Hiroshi Mizuno ,  Yasuyuki Abe ,  Takayuki Tanaka ,  Hayato Hasegawa ,  Shogo Shinkai

IPC: G06F3/044 ,  G06F3/041

CPC classification number: G06F3/044 ,  G06F3/041 ,  G06F3/0412 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04106

Abstract: A sensor device includes: a sensor layer provided at a position facing a surface, of a substrate having an operation surface, opposite to the operation surface, and configured to detect a contacted position or a pressed position on the operation surface; and a gap layer located in a gap between the substrate and the sensor layer. The gap layer includes a bonding region bonding the substrate to the sensor layer, and a relaxation region relaxing stress applied from the substrate to the sensor layer.

Abstract translation: 传感器装置包括：传感器层，设置在面向表面的位置处，具有与操作表面相对的操作表面的基板，并且被配置为检测操作表面上的接触位置或按压位置; 以及位于基板和传感器层之间的间隙中的间隙层。 间隙层包括将基板接合到传感器层的接合区域和从基板施加到传感器层的松弛区域的松弛区域。

公开(公告)号：US20160011691A1

公开(公告)日：2016-01-14

申请号：US14771918

申请日：2014-02-06

Applicant: SONY CORPORATION

Inventor： Shogo Shinkai ,  Kei Tsukamoto ,  Tomoko Katsuhara ,  Hiroto Kawaguchi ,  Hayato Hasegawa ,  Fumihiko lida ,  Takayuki Tanaka ,  Tomoaki Suzuki ,  Taizo Nishimura ,  Hiroshi Mizuno ,  Yasuyuki Abe

IPC: G06F3/044

CPC classification number: G06F3/044 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04107

Abstract: [Object] To provide a sensor device capable of detecting an operation position and pressing force with high accuracy.[Solution] A sensor device includes a first conductor layer having flexibility, a second conductor layer, an electrode substrate that is provided between the first conductor layer and the second conductor layer and has flexibility, a plurality of first structural bodies that separate the first conductor layer and the electrode substrate, and a plurality of second structural bodies that separate the electrode substrate and the second conductor layer. The electrode substrate includes a plurality of first electrodes and a plurality of second electrodes that intersect the plurality of first electrodes. A plurality of unit regions are provided to correspond to respective intersections between the first electrodes and the second electrodes. At least two of the first structural bodies and/or at least two of the second structural bodies are included in each unit region.

Abstract translation: 提供能够高精度地检测操作位置和按压力的传感器装置。 [解决方案]传感器装置包括具有柔性的第一导体层，第二导体层，设置在第一导体层和第二导体层之间并具有柔性的电极基板，多个第一结构体，其将第一导体 层和电极基板，以及分离电极基板和第二导体层的多个第二结构体。 电极基板包括与多个第一电极相交的多个第一电极和多个第二电极。 提供多个单元区域以对应于第一电极和第二电极之间的各个交叉点。 第一结构体中的至少两个和/或至少两个第二结构体包括在每个单位区域中。

公开(公告)号：US20170364182A1

公开(公告)日：2017-12-21

申请号：US15694688

申请日：2017-09-01

Applicant: Sony Corporation

Inventor： Hiroto Kawaguchi ,  Shogo Shinkai ,  Kei Tsukamoto ,  Tomoko Katsuhara ,  Hayato Hasegawa ,  Fumihiko Iida ,  Takayuki Tanaka ,  Tomoaki Suzuki ,  Taizo Nishimura ,  Hiroshi Mizuno ,  Yasuyuki Abe

IPC: G06F3/044 ,  G06F3/041 ,  G06F3/047

CPC classification number: G06F3/044 ,  G06F3/0414 ,  G06F3/047 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04106

Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.

公开(公告)号：US20180088709A1

公开(公告)日：2018-03-29

申请号：US15784108

申请日：2017-10-14

Applicant: Sony Corporation

Inventor： Takashi Itaya ,  Shogo Shinkai ,  Hiroto Kawaguchi ,  Fumihiko Iida ,  Hayato Hasegawa ,  Kei Tsukamoto ,  Takayuki Tanaka ,  Tomoko Katsuhara ,  Tomoaki Suzuki ,  Taizo Nishimura ,  Hiroshi Mizuno ,  Yasuyuki Abe

IPC: G06F3/044 ,  G06F3/047 ,  G06F3/041

CPC classification number: G06F3/044 ,  G06F3/0414 ,  G06F3/047 ,  G06F2203/04102

Abstract: There is provided a sensor device includes a sheet-like first conductor layer and an electrode substrate. The electrode substrate includes a plurality of first electrode wires, a plurality of second electrode wires, capacity sensors being formed at paired portions of the first and second electrode wires, and a sheet substrate that supports the first and second electrode wires. The sensor device also includes a first supporting body including a plurality of first structures that connect the first conductor layer and the electrode substrate.

公开(公告)号：US09811226B2

公开(公告)日：2017-11-07

申请号：US14914405

申请日：2014-08-22

Applicant: Sony Corporation

Inventor： Takashi Itaya ,  Shogo Shinkai ,  Hiroto Kawaguchi ,  Fumihiko Iida ,  Hayato Hasegawa ,  Kei Tsukamoto ,  Takayuki Tanaka ,  Tomoko Katsuhara ,  Tomoaki Suzuki ,  Taizo Nishimura ,  Hiroshi Mizuno ,  Yasuyuki Abe

IPC: G06F3/044 ,  G06F3/0488 ,  G06F3/041 ,  G06F3/047

CPC classification number: G06F3/044 ,  G06F3/0414 ,  G06F3/047 ,  G06F2203/04102

Abstract: There is provided a sensor device that includes a flexible first conductor layer and an electrode substrate. The electrode substrate includes a plurality of first electrode wires, a plurality of second electrode wires, capacity sensors being formed at capacitively coupled portions of the first and second electrode wires, and a flexible substrate that supports the first and second electrode wires. The sensor device also includes a first supporting body including a plurality of first structures that connect the first conductor layer and the electrode substrate.

公开(公告)号：US09632637B2

公开(公告)日：2017-04-25

申请号：US14463043

申请日：2014-08-19

Applicant: Sony Corporation

Inventor： Shogo Shinkai ,  Hayato Hasegawa ,  Hiroto Kawaguchi ,  Tomoko Katsuhara ,  Fumihiko Iida ,  Kei Tsukamoto ,  Takayuki Tanaka ,  Tomoaki Suzuki ,  Taizo Nishimura ,  Hiroshi Mizuno ,  Yasuyuki Abe

IPC: G06F3/044 ,  G06F1/16

CPC classification number: G06F3/044 ,  G06F1/1626 ,  G06F2203/04106

Abstract: A sensor device includes: a first sensor including a first electrode board including a plurality of first capacitive elements arranged in a matrix, a first conductor layer facing the first electrode board, a first support layer arranged between the first electrode board and the first conductor layer, the first support layer being deformable, and a first operation input surface provided on the first electrode board or the first conductor layer, the first electrode board and/or the first conductor layer being flexible; and a second sensor layered on the first sensor, the second sensor including a second electrode board including a plurality of second capacitive elements, a second conductor layer facing the second electrode board, and a second support layer arranged between the second electrode board and the second conductor layer, the second support layer being deformable, the second electrode board and/or the second conductor layer being flexible.