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公开(公告)号：US20170364182A1
公开(公告)日：2017-12-21
申请号：US15694688
申请日：2017-09-01
Applicant: Sony Corporation
Inventor： Hiroto Kawaguchi , Shogo Shinkai , Kei Tsukamoto , Tomoko Katsuhara , Hayato Hasegawa , Fumihiko Iida , Takayuki Tanaka , Tomoaki Suzuki , Taizo Nishimura , Hiroshi Mizuno , Yasuyuki Abe
CPC classification number: G06F3/044 , G06F3/0414 , G06F3/047 , G06F2203/04102 , G06F2203/04103 , G06F2203/04106
Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.
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公开(公告)号：US20130234734A1
公开(公告)日：2013-09-12
申请号：US13787309
申请日：2013-03-06
Applicant: SONY CORPORATION
Inventor： Fumihiko Iida , Hiroto Kawaguchi , Hayato Hasegawa , Takashi Itaya , Toshio Kano , Takayuki Tanaka , Kei Tsukamoto
IPC: G01R27/26
CPC classification number: G01R27/2605 , G01L1/146 , G06F3/0414 , G06F3/044 , G06F2203/04102 , G06F2203/04103
Abstract: A sensor unit is provided and includes a first substrate, first and second electrodes, an input portion disposed so that a gap exists between the substrate and the input portion, a plurality of first structures disposed in the gap and extending at least partially between the first substrate and the input portion, and a second insulating structure disposed on a side of the first structures that is away from the input portion, or between adjacent first structures. The sensor unit is configured to detect a change in capacitance between the first and second electrodes upon a change in position of the input portion relative to the first substrate.
Abstract translation: 提供传感器单元，其包括第一基板，第一和第二电极，设置成在基板和输入部分之间存在间隙的输入部分，设置在间隙中的多个第一结构，至少部分地延伸到第一 衬底和输入部分，以及设置在第一结构的远离输入部分或相邻的第一结构之间的第二绝缘结构。 传感器单元被配置为当输入部分相对于第一基板的位置改变时，检测第一和第二电极之间的电容变化。
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公开(公告)号：US10936128B2
公开(公告)日：2021-03-02
申请号：US16550934
申请日：2019-08-26
Applicant: Sony Corporation
Inventor： Hiroto Kawaguchi , Shogo Shinkai , Kei Tsukamoto , Tomoko Katsuhara , Hayato Hasegawa , Fumihiko Iida , Takayuki Tanaka , Tomoaki Suzuki , Taizo Nishimura , Hiroshi Mizuno , Yasuyuki Abe
Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.
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公开(公告)号：US20200097106A1
公开(公告)日：2020-03-26
申请号：US16550934
申请日：2019-08-26
Applicant: Sony Corporation
Inventor： Hiroto Kawaguchi , Shogo Shinkai , Kei Tsukamoto , Tomoko Katsuhara , Hayato Hasegawa , Fumihiko Iida , Takayuki Tanaka , Tomoaki Suzuki , Taizo Nishimura , Hiroshi Mizuno , Yasuyuki Abe
Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.
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公开(公告)号：US20160026297A1
公开(公告)日：2016-01-28
申请号：US14774732
申请日：2014-02-06
Applicant: SONY CORPORATION
Inventor： Shogo Shinkai , Kei Tsukamoto , Tomoko Katsuhara , Hiroto Kawaguchi , Hayato Hasegawa , Fumihiko lida , Takayuki Tanaka , Tomoaki Suzuki , Taizo Nishimura , Hiroshi Mizuno , Yasuyuki Abe
IPC: G06F3/044 , G06F3/041 , G06F3/0354
CPC classification number: G06F3/044 , G06F3/03547 , G06F3/0416 , G06F2203/04104 , G06F2203/04112
Abstract: [Object] To provide a sensor device capable of detecting an operation position and a pressing force with high accuracy.[Solution] A sensor device includes a first conductor layer, an electrode substrate, and a plurality of first structural bodies configured to separate the first conductor layer from the electrode substrate. At least one of the first conductor layer and the electrode substrate has flexibility. The electrode substrate includes a plurality of first electrodes and a plurality of second electrodes intersecting the plurality of first electrodes. At least one of the first and second electrodes includes a plurality of sub-electrodes.
Abstract translation: 提供能够高精度地检测操作位置和按压力的传感器装置。 传感器装置包括第一导体层，电极基板和被配置为将第一导体层与电极基板分开的多个第一结构体。 第一导体层和电极基板中的至少一个具有柔性。 电极基板包括多个第一电极和与多个第一电极相交的多个第二电极。 第一和第二电极中的至少一个包括多个子电极。
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Patent Agency Ranking
公开(公告)号：US20140151873A1
公开(公告)日：2014-06-05
申请号：US14018109
申请日：2013-09-04
Applicant: Sony Corporation
Inventor： Takayuki Tanaka , Kana Iwami
IPC: H01L23/00
CPC classification number: H01L24/09 , H01L21/563 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/743 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/16145 , H01L2224/16225 , H01L2224/26175 , H01L2224/27013 , H01L2224/27312 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/83102 , H01L2224/83104 , H01L2224/83193 , H01L2224/83385 , H01L2224/92125 , H01L2225/06513 , H01L2924/00 , H01L2924/00014 , H01L2224/13099
Abstract: A semiconductor device including a first semiconductor chip and a second semiconductor chip which are bump bonded to each other with a clearance therebetween sealed with resin injected from a prescribed position on the first semiconductor chip in a manner that a space between bumps formed by bump bonding is filled with the resin, and a plurality of concave and convex sections which are formed on a surface side of the first semiconductor chip, the surface being bonded with the second semiconductor chip, and have a protruding section which straddles at least one convex section out of convex sections of the plurality of concave and convex sections formed in a surrounding section of a bonding region between the first semiconductor chip and the second semiconductor chip.
Abstract translation: 一种半导体器件，包括第一半导体芯片和第二半导体芯片，该第一半导体芯片和第二半导体芯片以间隙形式彼此凸起接合，其间以从第一半导体芯片上的规定位置注入的树脂以凸起接合形成的凸块之间的间隔 填充有树脂，以及多个凹凸部，其形成在第一半导体芯片的表面侧，该表面与第二半导体芯片接合，并且具有跨过至少一个凸部的突出部， 形成在第一半导体芯片和第二半导体芯片之间的接合区域的周围部分中的多个凹凸部的凸部。
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公开(公告)号：US10386971B2
公开(公告)日：2019-08-20
申请号：US14910117
申请日：2014-07-23
Applicant: SONY CORPORATION
Inventor： Taizo Nishimura , Fumihiko Iida , Hiroshi Mizuno , Yasuyuki Abe , Takayuki Tanaka , Hayato Hasegawa , Shogo Shinkai
Abstract: A sensor device includes: a sensor layer provided at a position facing a surface, of a substrate having an operation surface, opposite to the operation surface, and configured to detect a contacted position or a pressed position on the operation surface; and a gap layer located in a gap between the substrate and the sensor layer. The gap layer includes a bonding region bonding the substrate to the sensor layer, and a relaxation region relaxing stress applied from the substrate to the sensor layer.
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公开(公告)号：US09785297B2
公开(公告)日：2017-10-10
申请号：US14763657
申请日：2013-12-06
Applicant: Sony Corporation
Inventor： Hiroto Kawaguchi , Shogo Shinkai , Kei Tsukamoto , Tomoko Katsuhara , Hayato Hasegawa , Fumihiko Iida , Takayuki Tanaka , Tomoaki Suzuki , Taizo Nishimura , Hiroshi Mizuno , Yasuyuki Abe
CPC classification number: G06F3/044 , G06F3/0414 , G06F3/047 , G06F2203/04102 , G06F2203/04103 , G06F2203/04106
Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.
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公开(公告)号：US20160202800A1
公开(公告)日：2016-07-14
申请号：US14914405
申请日：2014-08-22
Applicant: SONY CORPORATION
Inventor： Takashi Itaya , Shogo Shinkai , Hiroto Kawaguchi , Fumihiko Iida , Hayato Hasegawa , Kei Tsukamoto , Takayuki Tanaka , Tomoko Katsuhara , Tomoaki Suzuki , Taizo Nishimura , Hiroshi Mizuno , Yasuyuki Abe
CPC classification number: G06F3/044 , G06F3/0414 , G06F3/047 , G06F2203/04102
Abstract: There is provided a sensor device that includes a flexible first conductor layer and an electrode substrate. The electrode substrate includes a plurality of first electrode wires, a plurality of second electrode wires, capacity sensors being formed at capacitively coupled portions of the first and second electrode wires, and a flexible substrate that supports the first and second electrode wires. The sensor device also includes a first supporting body including a plurality of first structures that connect the first conductor layer and the electrode substrate.
Abstract translation: 提供了一种传感器装置，其包括柔性第一导体层和电极基板。 电极基板包括多个第一电极线，多个第二电极线，容量传感器，形成在第一和第二电极线的电容耦合部分，以及支撑第一和第二电极线的柔性基板。 传感器装置还包括第一支撑体，其包括连接第一导体层和电极基板的多个第一结构。
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公开(公告)号：US09201105B2
公开(公告)日：2015-12-01
申请号：US13787309
申请日：2013-03-06
Applicant: Sony Corporation
Inventor： Fumihiko Iida , Hiroto Kawaguchi , Hayato Hasegawa , Takashi Itaya , Toshio Kano , Takayuki Tanaka , Kei Tsukamoto
CPC classification number: G01R27/2605 , G01L1/146 , G06F3/0414 , G06F3/044 , G06F2203/04102 , G06F2203/04103
Abstract: A sensor unit is provided and includes a first substrate, first and second electrodes, an input portion disposed so that a gap exists between the substrate and the input portion, a plurality of first structures disposed in the gap and extending at least partially between the first substrate and the input portion, and a second insulating structure disposed on a side of the first structures that is away from the input portion, or between adjacent first structures. The sensor unit is configured to detect a change in capacitance between the first and second electrodes upon a change in position of the input portion relative to the first substrate.
Abstract translation: 提供传感器单元，其包括第一基板，第一和第二电极，设置成在基板和输入部分之间存在间隙的输入部分，设置在间隙中的多个第一结构，至少部分地延伸到第一 衬底和输入部分，以及设置在第一结构的远离输入部分或相邻的第一结构之间的第二绝缘结构。 传感器单元被配置为当输入部分相对于第一基板的位置改变时，检测第一和第二电极之间的电容变化。
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