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公开(公告)号：US20210280622A1
公开(公告)日：2021-09-09
申请号：US17252810
申请日：2019-06-07
发明人： HIDENORI MAEDA , TOSHIFUMI WAKANO , YUSUKE OTAKE
IPC分类号： H01L27/146 , H01L31/107
摘要： Providing a SPAD photodiode that accurately captures a subject regardless of long distance or short distance. A solid-state imaging apparatus (1000) according to the present disclosure includes: a pixel isolator (100) that defines a photoelectric conversion region (200) for each pixel; a first semiconductor layer (106) provided in the photoelectric conversion region; and a second semiconductor layer (108) to which a voltage for electron multiplication is applied, specifically between the first semiconductor layer and the second semiconductor layer, in which the sensitivities of the plurality of pixels are varied. With this configuration, it is possible to accurately capture a subject in the SPAD photodiode regardless of long distance or short distance.
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公开(公告)号：US20200177829A1
公开(公告)日：2020-06-04
申请号：US16631521
申请日：2018-06-21
IPC分类号： H04N5/374 , H01L27/146 , H04N5/341
摘要： [Problem] Provided is a solid-state imaging device with a higher degree of freedom of the size and layout of chips to be laminated. [Solution] The solid-state imaging device includes: a first substrate that has one principal surface on which a pixel portion in which pixels are arranged is formed; a second substrate which is bonded to a surface of the first substrate opposed to the one principal surface and in which an opening is provided in a partial region in a surface opposed to a bonding surface to the first substrate is provided; and at least one sub-chip which is provided inside the opening so as not to protrude from the opening and in which a circuit having a predetermined function is formed.
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公开(公告)号：US20220337773A1
公开(公告)日：2022-10-20
申请号：US17854284
申请日：2022-06-30
IPC分类号： H04N5/374 , H01L27/146
摘要： Provided is a solid-state imaging device that includes a first substrate that has one principal surface on which a pixel portion in which pixels are arranged is formed, a second substrate which is bonded to a surface of the first substrate opposed to the one principal surface and in which an opening is provided in a partial region in a surface opposed to a bonding surface to the first substrate is provided. The solid-state imaging device further includes at least one sub-chip inside the opening so as not to protrude from the opening and in which a circuit having a predetermined function is formed.
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