SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

    公开(公告)号:US20170358614A1

    公开(公告)日:2017-12-14

    申请号:US15541105

    申请日:2016-01-08

    摘要: The present technology relates to a solid-state imaging device that can achieve a higher resolution while increasing sensitivity, and an electronic apparatus. In a pixel array unit, pixels are two-dimensionally arranged, and the pixels are formed with a combination of: a first pixel that performs photoelectric conversion on light of a first color component with a first photoelectric conversion unit, and photoelectric conversion on light of a third color component with a second photoelectric conversion unit, the light of the third color component having passed through a first color filter and the first photoelectric conversion unit, the first color filter being designed to pass light of a second color component; a second pixel that performs photoelectric conversion on light of the first color component with a first photoelectric conversion unit, and photoelectric conversion on light of a fifth color component with a second photoelectric conversion unit, the light of the fifth color component having passed through a second color filter and the first photoelectric conversion unit, the second color filter being designed to pass light of a fourth color component; and a third pixel that performs photoelectric conversion on light of the first color component with a first photoelectric conversion unit, and photoelectric conversion on light of a sixth color component with a second photoelectric conversion unit, the light of the sixth color component having passed through the first photoelectric conversion unit. The first color component and the sixth color component are mixed, to generate white (W).

    SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

    公开(公告)号:US20230067160A1

    公开(公告)日:2023-03-02

    申请号:US18053733

    申请日:2022-11-08

    摘要: To provide a solid-state imaging device and an electronic apparatus capable of achieving both of a high dynamic range operation and an auto focus operation in a pixel configuration in which a plurality of unit pixels includes two or more subpixels. There is provided a solid-state imaging device including: a first pixel separation region that separates a plurality of unit pixels including two or more subpixels; a second pixel separation region that separates each of the plurality of unit pixels separated by the first pixel separation region; and an overflow region that causes signal charges accumulated in the subpixels to overflow to at least one of adjacent subpixels, in which the overflow region is formed between a first subpixel and a second subpixel.

    SOLID-STATE IMAGING APPARATUS AND ELECTRONIC APPARATUS

    公开(公告)号:US20210280622A1

    公开(公告)日:2021-09-09

    申请号:US17252810

    申请日:2019-06-07

    IPC分类号: H01L27/146 H01L31/107

    摘要: Providing a SPAD photodiode that accurately captures a subject regardless of long distance or short distance. A solid-state imaging apparatus (1000) according to the present disclosure includes: a pixel isolator (100) that defines a photoelectric conversion region (200) for each pixel; a first semiconductor layer (106) provided in the photoelectric conversion region; and a second semiconductor layer (108) to which a voltage for electron multiplication is applied, specifically between the first semiconductor layer and the second semiconductor layer, in which the sensitivities of the plurality of pixels are varied. With this configuration, it is possible to accurately capture a subject in the SPAD photodiode regardless of long distance or short distance.

    LIGHT-RECEIVING ELEMENT AND DISTANCE-MEASURING MODULE

    公开(公告)号:US20210270941A1

    公开(公告)日:2021-09-02

    申请号:US17250343

    申请日:2019-07-04

    摘要: The present technology relates to a light-receiving element and a distance-measuring module for enabling improvement of characteristics. A light-receiving element includes an on-chip lens, a wiring layer, and a semiconductor layer arranged between the on-chip lens and the wiring layer, the semiconductor layer includes a first voltage application portion to which a first voltage is applied, a second voltage application portion to which a second voltage different from the first voltage is applied, a first charge detection portion arranged around the first voltage application portion, and a second charge detection portion arranged around the second voltage application portion, and the wiring layer includes at least one ground line having a wider line width than a power supply line. The present technology can be applied to, for example, a light-receiving element that generates distance information by a ToF method.

    SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

    公开(公告)号:US20210144321A1

    公开(公告)日:2021-05-13

    申请号:US17250308

    申请日:2019-07-08

    摘要: To provide a solid-state imaging device and an electronic apparatus capable of achieving both of a high dynamic range operation and an auto focus operation in a pixel configuration in which a plurality of unit pixels includes two or more subpixels. There is provided a solid-state imaging device including: a first pixel separation region that separates a plurality of unit pixels including two or more subpixels; a second pixel separation region that separates each of the plurality of unit pixels separated by the first pixel separation region; and an overflow region that causes signal charges accumulated in the subpixels to overflow to at least one of adjacent subpixels, in which the overflow region is formed between a first subpixel and a second subpixel.