公开(公告)号：US20250145448A1

公开(公告)日：2025-05-08

申请号：US18387697

申请日：2023-11-07

Applicant: SPTS Technologies Limited

Inventor： Michael Grimes ,  Yuyuan Lin

IPC: B81B3/00 ,  B81C1/00

Abstract: An anti-stiction layer is formed from a first organosilane precursor. A second organosilane precursor is introduced around the workpiece with the anti-stiction layer. The second organosilane precursor is different from the first organosilane precursor. The second organosilane precursor is configured to eliminate defect sites and unreacted sites on the anti-stiction layer and on a surface of the workpiece that includes the anti-stiction layer.

公开(公告)号：US10655217B2

公开(公告)日：2020-05-19

申请号：US15968433

申请日：2018-05-01

Applicant: SPTS TECHNOLOGIES LIMITED

Inventor： Michael Grimes ,  Yuyuan Lin

IPC: C23C16/02 ,  B05D1/00 ,  C23C16/40 ,  C23C16/44 ,  C23C16/455 ,  H05K3/28

Abstract: A method of forming a passivation layer on a substrate includes providing a substrate in a processing chamber. The substrate includes a metallic surface which is a copper, tin or silver surface, or an alloyed surface of one or more of copper, tin or silver. The method further includes depositing at least one organic layer onto the metallic surface by vapour deposition, the organic layer formed from an organic precursor. The organic precursor includes a first functional group including at least one of oxygen, nitrogen, phosphorus, sulphur, selenium, tellurium, or silicon, and a second functional group selected from hydroxyl (—OH) or carboxyl (—COOH). The first functional group is adsorbed onto the metallic surface. The method further includes depositing at least one inorganic layer onto the organic layer by vapour deposition, wherein the second functional group acts as an attachment site for the inorganic layer.

公开(公告)号：US20220359332A1

公开(公告)日：2022-11-10

申请号：US17315342

申请日：2021-05-09

Applicant: SPTS Technologies Limited

Inventor： Michael Grimes ,  Yuyuan Lin

IPC: H01L23/31 ,  H01L21/56 ,  H01L21/02 ,  H01L23/29

Abstract: A substrate includes a metal component on a surface. A polymeric layer is deposited on the surface using molecular layer deposition. The polymeric layer includes a metalcone and has a thickness from 1 nm to 20 nm. The polymeric layer is stable at room temperature, but will undergo a structural change at high temperatures. The polymeric layer can be annealed to cause a structural change, which can occur during soldering.