公开(公告)号：US20250022728A1

公开(公告)日：2025-01-16

申请号：US18607498

申请日：2024-03-17

Applicant: SPTS Technologies Limited

Inventor： Attila Nagy ,  Phil Waller ,  Chris Jones

IPC: H01L21/67 ,  B65G47/90

Abstract: A transfer vacuum chamber for handling a substrate under vacuum conditions is in communication with at least two substrate modules connected to the transfer vacuum chamber by a respective connection slot. The at least two substrate modules can receive at least one substrate. At least one of the at least two substrate modules is a substrate processing module. At least two load lock chambers are in vacuum communication with the transfer vacuum chamber. The transfer vacuum chamber includes at least two transfer robots disposed within the transfer vacuum chamber configured to transfer a substrate between the at least two load lock chambers and the at least one substrate processing module under vacuum conditions.

公开(公告)号：US20210082722A1

公开(公告)日：2021-03-18

申请号：US16919180

申请日：2020-07-02

Applicant: SPTS Technologies Limited

Inventor： Attila Nagy ,  Kris Martin

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/68

Abstract: A wafer processing system has a transport vacuum chamber for handling a frame assembly under vacuum conditions, at least one vacuum cassette elevator load lock for housing a cassette and adjusting a vertical position of the cassette under vacuum conditions, and at least one wafer processing module in vacuum communication with the transport vacuum chamber. An actuating assembly changes guide members from an expanded configuration to a contracted configuration to reduce a first cross-sectional dimension of a frame assembly receiving area and to reduce a second cross-sectional dimension of the frame assembly receiving area that is perpendicular to the first cross-sectional dimension.

公开(公告)号：US11309198B2

公开(公告)日：2022-04-19

申请号：US16919180

申请日：2020-07-02

Applicant: SPTS Technologies Limited

Inventor： Attila Nagy ,  Kris Martin

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/68

Abstract: A wafer processing system has a transport vacuum chamber for handling a frame assembly under vacuum conditions, at least one vacuum cassette elevator load lock for housing a cassette and adjusting a vertical position of the cassette under vacuum conditions, and at least one wafer processing module in vacuum communication with the transport vacuum chamber. An actuating assembly changes guide members from an expanded configuration to a contracted configuration to reduce a first cross-sectional dimension of a frame assembly receiving area and to reduce a second cross-sectional dimension of the frame assembly receiving area that is perpendicular to the first cross-sectional dimension.