公开(公告)号：US20250022728A1

公开(公告)日：2025-01-16

申请号：US18607498

申请日：2024-03-17

Applicant: SPTS Technologies Limited

Inventor： Attila Nagy ,  Phil Waller ,  Chris Jones

IPC: H01L21/67 ,  B65G47/90

Abstract: A transfer vacuum chamber for handling a substrate under vacuum conditions is in communication with at least two substrate modules connected to the transfer vacuum chamber by a respective connection slot. The at least two substrate modules can receive at least one substrate. At least one of the at least two substrate modules is a substrate processing module. At least two load lock chambers are in vacuum communication with the transfer vacuum chamber. The transfer vacuum chamber includes at least two transfer robots disposed within the transfer vacuum chamber configured to transfer a substrate between the at least two load lock chambers and the at least one substrate processing module under vacuum conditions.