Abstract:
A process for bonding together cured rubbery films is disclosed, wherein cured polychloroprene, butyl rubber, and/or rubbery copolymers of ethylene with at least one other alpha-alkene of 3 to 8 carbon atoms are bonded together by placing a layer of a curable rubbery polymer composition which generates heat upon exposure to a high frequency electric field between the films and heating the assembly of films under pressure in an electric field having a frequency of about 0.1 to about 500 megacycles per second. The time of heating can be appreciably shortened without diminishing the strength of the bond between the films, and without film damage. The bonded films are suitable for sealing and lining applications.