公开(公告)号：US20250096095A1

公开(公告)日：2025-03-20

申请号：US18468957

申请日：2023-09-18

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Peik Eng Ooi ,  Beng Yee Teh ,  Linda Pei Ee Chua

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor device has a semiconductor die and an encapsulant deposited over the semiconductor die to form a reconstituted wafer. A first insulating layer is formed over the reconstituted wafer. A first dummy opening is formed in the first insulating layer. A first conductive layer is formed on the first insulating layer including a first contact pad over the first dummy opening.