公开(公告)号：US20230337369A1

公开(公告)日：2023-10-19

申请号：US18299072

申请日：2023-04-12

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： KyoWang KOO ,  KiCheol LEE ,  BoLee LIM

IPC: H05K3/12 ,  H01L23/00 ,  B23K37/06

CPC classification number: H05K3/1225 ,  H01L24/83 ,  B23K37/06 ,  H01L2224/83815 ,  H01L2224/83192 ,  B23K2101/42

Abstract: A stencil mask and a stencil printing method are provided. The stencil mask includes: a non-reinforcement portion having a mask surface configured to contact a substrate surface of a substrate; and a reinforcement portion having a thickness greater than that of the non-reinforcement portion, wherein the reinforcement portion includes: an embossed surface for insertion into a cavity of substrate and configured to contact a cavity bottom surface when the stencil mask is placed onto the substrate for stencil printing; and at least one first stencil window that allows the fluid material to flow through the reinforcement portion, wherein the at least one first stencil window is aligned with the at least one printing region within the cavity when the stencil mask is placed onto the substrate for stencil printing.