公开(公告)号：US20240105569A1

公开(公告)日：2024-03-28

申请号：US18460623

申请日：2023-09-04

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ByungHyun KWAK

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/66 ,  H01L23/31 ,  H01L23/544 ,  H01L25/10

CPC classification number: H01L23/49822 ,  H01L21/4853 ,  H01L22/12 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/544 ,  H01L25/105 ,  H01L24/16 ,  H01L2223/54426 ,  H01L2224/16225

Abstract: An integrated package and a method for making the same are provided. The integrated package includes: a first substrate including: a first interconnection area having a plurality of first interconnection structures; and a first alignment structure disposed outside the first interconnection area; a second substrate stacked above the first substrate and including: a second interconnection area having a plurality of second interconnection structures; and a second alignment structure disposed outside the second interconnection area, wherein the second alignment structure is substantially aligned with the first alignment structure in a stacking direction of the first substrate and the second substrate; and a connecting element disposed between the first substrate and the second substrate and configured for electrically connecting at least one of the plurality of first interconnection structures with at least one of the plurality of second interconnection structures.