公开(公告)号：US20240234292A1

公开(公告)日：2024-07-11

申请号：US18150634

申请日：2023-01-05

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： YongMoo Shin ,  HeeSoo Lee ,  EunHee Myung

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L25/10 ,  H01L25/16

CPC classification number: H01L23/49877 ,  H01L21/4853 ,  H01L21/4867 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L25/105 ,  H01L25/162 ,  H01L25/165 ,  H01L24/16

Abstract: A semiconductor device includes a first substrate and a second substrate. A graphene-coated interconnect is disposed between the first substrate and second substrate. A semiconductor die is disposed between the first substrate and second substrate. The first substrate is electrically coupled to the second substrate through the graphene-coated interconnect. An encapsulant is deposited between the first substrate and second substrate.