公开(公告)号：US20230411304A1

公开(公告)日：2023-12-21

申请号：US18313316

申请日：2023-05-06

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Heeyoun KIM ,  KyoWang KOO ,  Junghoon KIM ,  Youngsang KIM ,  Kyungmoon KIM

IPC: H01L23/552 ,  H01L21/48

CPC classification number: H01L23/552 ,  H01L21/4814

Abstract: A semiconductor device and a method for making the same are provided. The semiconductor device includes: a substrate including a substrate top surface and a substrate bottom surface; an electronic component mounted on the substrate top surface; a bottom encapsulant disposed on the substrate top surface and encapsulating the electronic component; a top encapsulant disposed on the bottom encapsulant; an internal shielding layer disposed between the bottom encapsulant and the top encapsulant, wherein a projection of the internal shielding layer onto the substrate top surface overlaps with the electronic component, the internal shielding layer has an internal shielding layer lateral surface, and a portion of the internal shielding layer lateral surface is exposed from the bottom encapsulant and the top encapsulant; and an external shielding layer covering the bottom encapsulant and the top encapsulant and contacting with the exposed portion of the internal shielding layer lateral surface.