公开(公告)号：US20230215813A1

公开(公告)日：2023-07-06

申请号：US17647069

申请日：2022-01-05

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： GunHyuck Lee ,  HyunKyu Lee ,  MinJung Kim

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L23/3128

Abstract: A semiconductor device is made by providing a strip substrate including a plurality of units. A hole is formed in the strip substrate. An encapsulant is deposited over the strip substrate. A mask is disposed over the strip substrate and encapsulant with a leg of the mask disposed in the hole. A shielding layer is formed over the mask and strip substrate. The mask is removed after forming the shielding layer. The strip substrate is singulated to separate the plurality of units from each other after forming the shielding layer.