公开(公告)号：US20230395477A1

公开(公告)日：2023-12-07

申请号：US17805096

申请日：2022-06-02

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： GunHyuck Lee ,  HeeSoo Lee ,  SangHyun Son ,  Bokyeong Hwang

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/552 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49805 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/552 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565

Abstract: A semiconductor device has an interconnect substrate with a conductive via. A first electrical component is disposed over a major surface of the interconnect substrate. An electrical interconnect compound is disposed over the conductive via exposed from a side surface of the interconnect substrate. The electrical interconnect compound can be applied with a tilt nozzle oriented at an angle. A second electrical component is disposed on the electrical interconnect compound on the conductive via exposed from the side surface of the interconnect substrate. A plurality of second electrical components can be disposed on two or more side surfaces of the interconnect substrate. The interconnect substrate can have a plurality of stacked conductive vias and the second electrical component is disposed over the stacked conductive vias. An encapsulant is deposited over the first electrical component and interconnect substrate. A shielding layer can be formed over the encapsulant.

公开(公告)号：US20240088060A1

公开(公告)日：2024-03-14

申请号：US18517859

申请日：2023-11-22

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： GunHyuck Lee

IPC: H01L23/552 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/552 ,  H01L24/20 ,  H01L25/0652 ,  H01L2224/2205 ,  H01L2924/3025

Abstract: A semiconductor device has a first substrate and a first electrical component disposed over the first substrate. A first support frame is disposed over the first substrate. The first support frame has a horizontal support channel extending across the first substrate and a vertical support brace extending from the horizontal support channel to the first substrate. The first support frame can have a vertical shielding partition extending from the horizontal support channel to the first substrate. An encapsulant is deposited over the first electrical component and first substrate and around the first support frame. A second electrical component is disposed over the first electrical component. A second substrate is disposed over the first support frame. A second electrical component is disposed over the second substrate. A third substrate is disposed over the second substrate. A second support frame is disposed over the second substrate.

公开(公告)号：US20230050884A1

公开(公告)日：2023-02-16

申请号：US17444853

申请日：2021-08-11

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： GunHyuck Lee

IPC: H01L23/552 ,  H01L25/065 ,  H01L23/00

Abstract: A semiconductor device has a first substrate and a first electrical component disposed over the first substrate. A first support frame is disposed over the first substrate. The first support frame has a horizontal support channel extending across the first substrate and a vertical support brace extending from the horizontal support channel to the first substrate. The first support frame can have a vertical shielding partition extending from the horizontal support channel to the first substrate. An encapsulant is deposited over the first electrical component and first substrate and around the first support frame. A second electrical component is disposed over the first electrical component. A second substrate is disposed over the first support frame. A second electrical component is disposed over the second substrate. A third substrate is disposed over the second substrate. A second support frame is disposed over the second substrate.

公开(公告)号：US12288754B2

公开(公告)日：2025-04-29

申请号：US18517859

申请日：2023-11-22

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： GunHyuck Lee

IPC: H01L23/552 ,  H01L23/00 ,  H01L25/065

Abstract: A semiconductor device has a first substrate and a first electrical component disposed over the first substrate. A first support frame is disposed over the first substrate. The first support frame has a horizontal support channel extending across the first substrate and a vertical support brace extending from the horizontal support channel to the first substrate. The first support frame can have a vertical shielding partition extending from the horizontal support channel to the first substrate. An encapsulant is deposited over the first electrical component and first substrate and around the first support frame. A second electrical component is disposed over the first electrical component. A second substrate is disposed over the first support frame. A second electrical component is disposed over the second substrate. A third substrate is disposed over the second substrate. A second support frame is disposed over the second substrate.

公开(公告)号：US12176335B2

公开(公告)日：2024-12-24

申请号：US17649005

申请日：2022-01-26

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： GunHyuck Lee ,  SangHyun Son ,  Yujeong Jang ,  Hyeoneui Lee

IPC: H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00 ,  H01L25/10

Abstract: A semiconductor device has a first semiconductor package including a substrate and an encapsulant deposited over the substrate. An adhesive tape is disposed on the encapsulant. A conductive via is formed by trench cutting through the adhesive tape and encapsulant to expose the substrate. A second semiconductor package is disposed over the adhesive tape opposite the first semiconductor package. The first semiconductor package and second semiconductor package are bonded together by the adhesive tape.

公开(公告)号：US20240063194A1

公开(公告)日：2024-02-22

申请号：US17820502

申请日：2022-08-17

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： GunHyuck Lee ,  Yujeong Jang ,  Gayeun Kim ,  YoungUk Noh

IPC: H01L25/16 ,  H01L21/56 ,  H01L25/00 ,  H01L25/065 ,  H01L23/552 ,  H01L23/498 ,  H01L23/538 ,  H01L23/48

CPC classification number: H01L25/162 ,  H01L21/56 ,  H01L25/50 ,  H01L25/0655 ,  H01L23/552 ,  H01L23/49833 ,  H01L23/5389 ,  H01L23/481 ,  H01L23/5383 ,  H01L24/16

Abstract: A semiconductor device has a first semiconductor package, second semiconductor package, and RDL. The first semiconductor package is disposed over a first surface of the RDL and the second semiconductor package is disposed over a second surface of the RDL opposite the first surface of the RDL. A carrier is initially disposed over the second surface of the RDL and removed after disposing the first semiconductor package over the first surface of the RDL. The first semiconductor package has a substrate, plurality of conductive pillars formed over the substrate, electrical component disposed over the substrate, and encapsulant deposited around the conductive pillars and electrical component. A shielding frame can be disposed around the electrical component. An antenna can be disposed over the first semiconductor package. A portion of the encapsulant is removed to planarize a surface of the encapsulant and expose the conductive pillars.

公开(公告)号：US11869848B2

公开(公告)日：2024-01-09

申请号：US17444853

申请日：2021-08-11

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： GunHyuck Lee

IPC: H01L23/552 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/552 ,  H01L24/20 ,  H01L25/0652 ,  H01L2224/2205 ,  H01L2924/3025

Abstract: A semiconductor device has a first substrate and a first electrical component disposed over the first substrate. A first support frame is disposed over the first substrate. The first support frame has a horizontal support channel extending across the first substrate and a vertical support brace extending from the horizontal support channel to the first substrate. The first support frame can have a vertical shielding partition extending from the horizontal support channel to the first substrate. An encapsulant is deposited over the first electrical component and first substrate and around the first support frame. A second electrical component is disposed over the first electrical component. A second substrate is disposed over the first support frame. A second electrical component is disposed over the second substrate. A third substrate is disposed over the second substrate. A second support frame is disposed over the second substrate.

公开(公告)号：US20230238376A1

公开(公告)日：2023-07-27

申请号：US17649005

申请日：2022-01-26

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： GunHyuck Lee ,  SangHyun Son ,  Yujeong Jang ,  Hyeoneui Lee

IPC: H01L25/00 ,  H01L25/10 ,  H01L21/683 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L25/50 ,  H01L25/105 ,  H01L21/6835 ,  H01L21/568 ,  H01L21/4846 ,  H01L21/4853 ,  H01L2225/1041 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2221/68359

Abstract: A semiconductor device has a first semiconductor package including a substrate and an encapsulant deposited over the substrate. An adhesive tape is disposed on the encapsulant. A conductive via is formed by trench cutting through the adhesive tape and encapsulant to expose the substrate. A second semiconductor package is disposed over the adhesive tape opposite the first semiconductor package. The first semiconductor package and second semiconductor package are bonded together by the adhesive tape.

公开(公告)号：US20230215813A1

公开(公告)日：2023-07-06

申请号：US17647069

申请日：2022-01-05

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： GunHyuck Lee ,  HyunKyu Lee ,  MinJung Kim

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L23/3128

Abstract: A semiconductor device is made by providing a strip substrate including a plurality of units. A hole is formed in the strip substrate. An encapsulant is deposited over the strip substrate. A mask is disposed over the strip substrate and encapsulant with a leg of the mask disposed in the hole. A shielding layer is formed over the mask and strip substrate. The mask is removed after forming the shielding layer. The strip substrate is singulated to separate the plurality of units from each other after forming the shielding layer.