公开(公告)号：US20220365436A1

公开(公告)日：2022-11-17

申请号：US17319785

申请日：2021-05-13

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Giwoong Nam ,  Junghwan Jang ,  Inhee Hwang ,  Taekyu Choi ,  Sanghyun Park

IPC: G03F7/16 ,  H01L21/02

Abstract: A semiconductor manufacturing device has an outer cup and inner cup with a wafer suction mount disposed within the outer cup. A photoresist material is applied to a first surface of a semiconductor wafer disposed on the wafer suction mount while rotating at a first speed. A gas port is disposed on the inner cup for dispensing a gas oriented toward a bottom side of the semiconductor wafer. The gas port purges a second surface of the semiconductor wafer with a gas to remove contamination. The second surface of the semiconductor wafer is rinsed while purging with the gas. The gas can be a stable or inert gas, such as nitrogen. The contamination is removed from the second surface of the semiconductor wafer through an outlet between the inner cup and outer cup. The semiconductor wafer rotates at a second greater speed after discontinuing purge with the gas.

公开(公告)号：US11994801B2

公开(公告)日：2024-05-28

申请号：US17319785

申请日：2021-05-13

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Giwoong Nam ,  Junghwan Jang ,  Inhee Hwang ,  Taekyu Choi ,  Sanghyun Park

IPC: G03F7/16 ,  B05C11/06 ,  H01L21/02

CPC classification number: G03F7/168 ,  B05C11/06 ,  G03F7/162 ,  G03F7/164 ,  H01L21/0209

Abstract: A semiconductor manufacturing device has an outer cup and inner cup with a wafer suction mount disposed within the outer cup. A photoresist material is applied to a first surface of a semiconductor wafer disposed on the wafer suction mount while rotating at a first speed. A gas port is disposed on the inner cup for dispensing a gas oriented toward a bottom side of the semiconductor wafer. The gas port purges a second surface of the semiconductor wafer with a gas to remove contamination. The second surface of the semiconductor wafer is rinsed while purging with the gas. The gas can be a stable or inert gas, such as nitrogen. The contamination is removed from the second surface of the semiconductor wafer through an outlet between the inner cup and outer cup. The semiconductor wafer rotates at a second greater speed after discontinuing purge with the gas.

公开(公告)号：US20230259033A1

公开(公告)日：2023-08-17

申请号：US17650709

申请日：2022-02-11

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Giwoong Nam ,  Junghwan Jang ,  Inhee Hwang

IPC: G03F7/16 ,  H01L21/027

CPC classification number: G03F7/162 ,  H01L21/027

Abstract: A semiconductor manufacturing device has an outer cup and inner cup with a wafer mount disposed within the outer cup. A semiconductor wafer is disposed on the wafer mount. A dispenser dispenses a photoresist material onto a surface of the semiconductor wafer. A controller controls the dispenser to apply in a single application, the photoresist material to the surface of the semiconductor wafer while rotating at a first speed to form a thickness of the photoresist material up to 12.0 micrometers, or in the range of 3.0 to 12.0 micrometers. The first speed ranges from 400 to 700 RPM. The controller controls the dispenser to discontinue application of the photoresist material while rotating the semiconductor wafer at the first speed. The photoresist material dries while rotating the semiconductor wafer. The controller controls the dispenser to apply a coating to the semiconductor wafer prior to applying the photoresist material.

公开(公告)号：US20240272555A1

公开(公告)日：2024-08-15

申请号：US18644515

申请日：2024-04-24

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Giwoong Nam ,  Junghwan Jang ,  Inhee Hwang ,  Taekyu Choi ,  Sanghyun Park

IPC: G03F7/16 ,  B05C11/06 ,  H01L21/02

CPC classification number: G03F7/168 ,  B05C11/06 ,  G03F7/162 ,  G03F7/164 ,  H01L21/0209

Abstract: A semiconductor manufacturing device has an outer cup and inner cup with a wafer suction mount disposed within the outer cup. A photoresist material is applied to a first surface of a semiconductor wafer disposed on the wafer suction mount while rotating at a first speed. A gas port is disposed on the inner cup for dispensing a gas oriented toward a bottom side of the semiconductor wafer. The gas port purges a second surface of the semiconductor wafer with a gas to remove contamination. The second surface of the semiconductor wafer is rinsed while purging with the gas. The gas can be a stable or inert gas, such as nitrogen. The contamination is removed from the second surface of the semiconductor wafer through an outlet between the inner cup and outer cup. The semiconductor wafer rotates at a second greater speed after discontinuing purge with the gas.