公开(公告)号：US20240021490A1

公开(公告)日：2024-01-18

申请号：US17812224

申请日：2022-07-13

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Jongtae Kim

IPC: H01L23/367 ,  H01L25/16 ,  H01L23/552 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/3675 ,  H01L25/165 ,  H01L25/162 ,  H01L23/552 ,  H01L21/4882 ,  H01L23/49816 ,  H01L24/16

Abstract: A semiconductor device has a substrate and a semiconductor package disposed over the substrate. An embedded bar (e-bar) substrate is disposed on the substrate around the semiconductor package. A heat sink is formed over the semiconductor package and supported by the e-bar substrate to elevate the heat sink from the substrate and reduce a thickness of the heat sink. A thermal interface material is deposited between the semiconductor package and heat sink. Alternatively, a shield layer can be formed over the semiconductor package and supported by the e-bar substrate. The e-bar substrate has a base layer and a first metal layer formed over a first surface of the base layer. A bump is formed over the first metal layer. A second metal layer can be over a second surface of the base layer opposite the first surface of the base layer. Two or more e-bar substrates can be stacked.