公开(公告)号：US11088082B2

公开(公告)日：2021-08-10

申请号：US16116485

申请日：2018-08-29

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Changoh Kim ,  Kyounghee Park ,  Kyowang Koo ,  Sungwon Cho

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/04 ,  H01L25/065 ,  H01L21/78 ,  H01L25/00 ,  H01L21/56

Abstract: A semiconductor device has a substrate. A lid is disposed over the substrate. An encapsulant is deposited over the substrate. A film mask is disposed over the encapsulant with the lid exposed from the film mask and encapsulant. A conductive layer is formed over the film mask, encapsulant, and lid. The film mask is removed after forming the conductive layer.

公开(公告)号：US11594438B2

公开(公告)日：2023-02-28

申请号：US17339210

申请日：2021-06-04

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Hyeonchul Lee ,  Kyounghee Park ,  Kyunghwan Kim

IPC: H01L21/673

Abstract: A semiconductor manufacturing equipment has an outer case housing including a lower case extension to support a semiconductor panel. The lower case extension is fixed in position within the outer case housing. An inner case housing having an upper case extension is disposed within the outer case housing in proximity to the lower case extension. A mechanism draws the upper case extension toward the lower case extension and locks the semiconductor panel in place between the upper case extension and lower case extension. The mechanism has a cam assembly disposed above the inner case housing and operatable with a handle to rotate the cam assembly and apply pressure to the inner case housing and upper case extension to lock the semiconductor panel in place between the upper case extension and lower case extension. A spring or other elastic mechanism is disposed under the inner case housing to load the pressure.

公开(公告)号：US20220392795A1

公开(公告)日：2022-12-08

申请号：US17339210

申请日：2021-06-04

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Hyeonchul Lee ,  Kyounghee Park ,  Kyunghwan Kim

IPC: H01L21/673

Abstract: A semiconductor manufacturing equipment has an outer case housing including a lower case extension to support a semiconductor panel. The lower case extension is fixed in position within the outer case housing. An inner case housing having an upper case extension is disposed within the outer case housing in proximity to the lower case extension. A mechanism draws the upper case extension toward the lower case extension and locks the semiconductor panel in place between the upper case extension and lower case extension. The mechanism has a cam assembly disposed above the inner case housing and operatable with a handle to rotate the cam assembly and apply pressure to the inner case housing and upper case extension to lock the semiconductor panel in place between the upper case extension and lower case extension. A spring or other elastic mechanism is disposed under the inner case housing to load the pressure.