公开(公告)号：US11088082B2

公开(公告)日：2021-08-10

申请号：US16116485

申请日：2018-08-29

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Changoh Kim ,  Kyounghee Park ,  Kyowang Koo ,  Sungwon Cho

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/04 ,  H01L25/065 ,  H01L21/78 ,  H01L25/00 ,  H01L21/56

Abstract: A semiconductor device has a substrate. A lid is disposed over the substrate. An encapsulant is deposited over the substrate. A film mask is disposed over the encapsulant with the lid exposed from the film mask and encapsulant. A conductive layer is formed over the film mask, encapsulant, and lid. The film mask is removed after forming the conductive layer.