公开(公告)号：US20180261550A1

公开(公告)日：2018-09-13

申请号：US15456873

申请日：2017-03-13

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Sungwon Cho ,  Seonhong Choi ,  Changoh Kim

IPC: H01L23/552 ,  H01L23/29 ,  H01L43/10

CPC classification number: H01L23/552 ,  H01L23/3128 ,  H01L23/3135

Abstract: A semiconductor device has a substrate and a semiconductor component disposed over the substrate. A discrete electrical device can be disposed over the substrate. An encapsulant is deposited over the substrate and semiconductor component. A ferromagnetic material is disposed over the encapsulant. The ferromagnetic material includes one or more ferrite type materials or other material having a crystalline structure exhibiting ferromagnetic properties. The ferromagnetic material includes a ferromagnetic film with a polyethylene terephthalate layer, ferrite layer, and adhesive layer. The ferromagnetic film is provided from the sheet of ferromagnetic films. A shielding layer is formed over the ferromagnetic material and around the semiconductor component. The ferromagnetic material provides magnetic shielding to reduce the influence of magnetic flux fields on the semiconductor die over all frequency bands, including low-frequency interference, by forming a low reluctance magnetic flux loop to redirect the magnetic flux fields away from the semiconductor die.

公开(公告)号：US10388611B2

公开(公告)日：2019-08-20

申请号：US15456873

申请日：2017-03-13

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Sungwon Cho ,  Seonhong Choi ,  Changoh Kim

IPC: H01L23/552 ,  H01L43/10 ,  H01L23/31

Abstract: A semiconductor device has a substrate and a semiconductor component disposed over the substrate. A discrete electrical device can be disposed over the substrate. An encapsulant is deposited over the substrate and semiconductor component. A ferromagnetic material is disposed over the encapsulant. The ferromagnetic material includes one or more ferrite type materials or other material having a crystalline structure exhibiting ferromagnetic properties. The ferromagnetic material includes a ferromagnetic film with a polyethylene terephthalate layer, ferrite layer, and adhesive layer. The ferromagnetic film is provided from the sheet of ferromagnetic films. A shielding layer is formed over the ferromagnetic material and around the semiconductor component. The ferromagnetic material provides magnetic shielding to reduce the influence of magnetic flux fields on the semiconductor die over all frequency bands, including low-frequency interference, by forming a low reluctance magnetic flux loop to redirect the magnetic flux fields away from the semiconductor die.

公开(公告)号：US11088082B2

公开(公告)日：2021-08-10

申请号：US16116485

申请日：2018-08-29

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Changoh Kim ,  Kyounghee Park ,  Kyowang Koo ,  Sungwon Cho

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/04 ,  H01L25/065 ,  H01L21/78 ,  H01L25/00 ,  H01L21/56

Abstract: A semiconductor device has a substrate. A lid is disposed over the substrate. An encapsulant is deposited over the substrate. A film mask is disposed over the encapsulant with the lid exposed from the film mask and encapsulant. A conductive layer is formed over the film mask, encapsulant, and lid. The film mask is removed after forming the conductive layer.