公开(公告)号：US20240332051A1

公开(公告)日：2024-10-03

申请号：US18193820

申请日：2023-03-31

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Yaojian Lin ,  DanFeng Yang ,  SongHua Xu

IPC: H01L21/673

CPC classification number: H01L21/67383 ,  H01L21/67294

Abstract: A front opening unified pod has a housing and a plurality of horizontal support members disposed within the housing and adapted to accommodate a plurality of semiconductor wafers or panels. The plurality of semiconductor wafers or panels have a different size or shape, such as circular and rectangular. A first one of the plurality of horizontal support members has a wing to support the plurality of different size or shape semiconductor wafers or panels. The plurality of horizontal support members has a first side horizontal support member, a second side horizontal support member, and a center horizontal support member disposed between the first side horizontal support member and the second side horizontal support member. The plurality of horizontal support members is insertable into the housing. One or more of the plurality of horizontal support members has an opening for laser identification.