公开(公告)号：US20240332051A1

公开(公告)日：2024-10-03

申请号：US18193820

申请日：2023-03-31

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Yaojian Lin ,  DanFeng Yang ,  SongHua Xu

IPC: H01L21/673

CPC classification number: H01L21/67383 ,  H01L21/67294

Abstract: A front opening unified pod has a housing and a plurality of horizontal support members disposed within the housing and adapted to accommodate a plurality of semiconductor wafers or panels. The plurality of semiconductor wafers or panels have a different size or shape, such as circular and rectangular. A first one of the plurality of horizontal support members has a wing to support the plurality of different size or shape semiconductor wafers or panels. The plurality of horizontal support members has a first side horizontal support member, a second side horizontal support member, and a center horizontal support member disposed between the first side horizontal support member and the second side horizontal support member. The plurality of horizontal support members is insertable into the housing. One or more of the plurality of horizontal support members has an opening for laser identification.

公开(公告)号：US20250140730A1

公开(公告)日：2025-05-01

申请号：US18498494

申请日：2023-10-31

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Yaojian Lin ,  Linda Pei Ee Chua ,  DanFeng Yang ,  Hin Hwa Goh

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01Q1/22

Abstract: A semiconductor device has an electrical component and a first interconnect structure disposed adjacent to the electrical component. The electrical component can be a direct metal bonded semiconductor die or a flipchip semiconductor die. The first interconnect structure can be an interposer unit or a conductive pillar. A split antenna is disposed over the electrical component and first interconnect structure. The split antenna has a first antenna section and a second antenna section with an adhesive material disposed between the first antenna section and second antenna section. A second interconnect structure is formed over the electrical component and first interconnect structure. The second interconnect structure has one or more conductive layers and insulating layers. The first interconnect structure and second interconnect structure provide a conduction path between the electrical component and split antenna. An encapsulant is deposited around the electrical component and first interconnect structure.

公开(公告)号：US20250132291A1

公开(公告)日：2025-04-24

申请号：US18492047

申请日：2023-10-23

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： DanFeng Yang ,  Yaojian Lin ,  Linda Pei Ee Chua ,  Kai Chong Chan ,  Jian Zuo

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H05K1/11 ,  H05K1/18

Abstract: A semiconductor device has a first interconnect structure. A first bridge die is disposed over the first interconnect structure. An encapsulant is deposited over the first bridge die. A second interconnect structure is formed over the first bridge die and encapsulant. A second bridge die is disposed over the second interconnect structure.