公开(公告)号：US20230411831A1

公开(公告)日：2023-12-21

申请号：US18334375

申请日：2023-06-14

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak LEE ,  SangHo SONG ,  YeonJee LEE

IPC: H01Q1/24 ,  H01L23/66 ,  H01L23/64 ,  H01L23/498

CPC classification number: H01Q1/243 ,  H01L23/66 ,  H01L23/645 ,  H01L23/49816 ,  H01L2223/6677

Abstract: An antenna module comprises: an antenna body comprising a first surface for attaching the antenna module to an external substrate, and a second surface through which the antenna module transmits and receives electromagnetic signals, wherein the first surface is opposite to the second surface; an antenna conductive pattern formed within the antenna body; and a shielding fence laterally surrounding the antenna conductive pattern for shielding electromagnetic interferences.

公开(公告)号：US20230402400A1

公开(公告)日：2023-12-14

申请号：US18332779

申请日：2023-06-12

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak LEE ,  SangHo SONG ,  YeonJee LEE ,  HeeSoo LEE

IPC: H01L23/552 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/56

Abstract: A method for making a semiconductor device comprises: providing a substrate having a first region and a second region, wherein the first region comprises at least one electronic component and a conductive pattern formed therein; forming a conductive bar on the conductive pattern; forming an encapsulant layer in the first region of the substrate to cover the at least one electronic component, the conductive bar and the conductive pattern; removing a portion of the encapsulant layer that is above the conductive bar to expose the conductive bar and separate the encapsulant layer into a main portion and a peripheral portion; disposing a deposition mask above the substrate to cover the second region; and depositing a conductive material on the substrate to form a shielding layer on the substrate which is not covered by the deposition mask.