公开(公告)号：US09318517B1

公开(公告)日：2016-04-19

申请号：US14290619

申请日：2014-05-29

Applicant: STC.UNM

Inventor： John A Montoya ,  Sanjay Krishna ,  Stephen Myers

IPC: H01L27/146

CPC classification number: H01L27/14687 ,  H01L27/14632 ,  H01L27/14634

Abstract: Apparatus, systems, and methods related to focal plane arrays can be used in a variety of applications. In various embodiments, focal plane arrays can be fabricated on a wafer integration level based on arrangement of a flexible conductive layer for photosensitive pixels of the focal plane arrays. Arrangement of a flexible conductive layer allows for a number of architectures of focal plane arrays. Additional apparatus, systems, and methods are disclosed.

Abstract translation: 与焦平面阵列相关的装置，系统和方法可用于各种应用中。 在各种实施例中，基于用于焦平面阵列的感光像素的柔性导电层的布置，可以在晶片集成度上制造焦平面阵列。 柔性导电层的布置允许多个焦平面阵列的架构。 公开了附加装置，系统和方法。