公开(公告)号：US20220339922A1

公开(公告)日：2022-10-27

申请号：US17675520

申请日：2022-02-18

Applicant: STI CO., LTD.

Inventor： Eun Su JEON ,  Kyu Yong HAN ,  Sang Pil PARK ,  Jae Hwan KIM

IPC: B32B37/02 ,  B32B38/18 ,  B32B41/00 ,  B32B39/00

Abstract: Disclosed is a lamination system. A lamination system, which bonds a panel and a bonding target panel to from a panel assembly, according to one embodiment of the present invention may include a transfer which moves along a transfer shuttle and supports any one among the panel, the bonding target panel, and the panel assembly, a bonding chamber which is provided parallel to the transfer shuttle and bonds the panel and the bonding target panel, and a first robot which transfers any one among the panel, the bonding target panel, and the panel assembly between the transfer and the bonding chamber.

公开(公告)号：US20230029555A1

公开(公告)日：2023-02-02

申请号：US17861935

申请日：2022-07-11

Applicant: STI CO., LTD.

Inventor： Dae Il YOU ,  Eun Su JEON ,  Sang Pil PARK ,  Kyu Yong HAN

IPC: B32B37/12 ,  B32B38/18 ,  B32B41/00

Abstract: Disclosed are an adhesive layer forming apparatus and a display device manufacturing system including the same. The adhesive layer forming apparatus includes a first support chuck configured to move a first panel along a panel movement path in a first direction, a second support chuck provided side by side with the first support chuck in a second direction orthogonal to the first direction and configured to move a second panel along a panel movement path, and a first gantry configured to move a first head, which faces the first support chuck and the second support chuck, in the second direction on the first support chuck and the second support chuck and forms an adhesive layer on any one of the first panel and the second panel by jetting.