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公开(公告)号:US20220314603A1
公开(公告)日:2022-10-06
申请号:US17675495
申请日:2022-02-18
Applicant: STI CO., LTD.
Inventor: Sang Pil PARK , Kyu Yong HAN , Byoung Hoon GONG , Young Ho KIM
IPC: B41J2/045
Abstract: Disclosed is a method of controlling an inkjet printing process. According to one embodiment of the present invention, a method of controlling an inkjet printing process by using an inkjet print system, the method including a printing operation of moving a first support chuck or a second support chuck in a second direction perpendicular to a first direction and performing the inkjet printing process of discharging an ink onto a substrate and a first suction operation of suctioning remaining ink from a nozzle formed on a first head or a second head using a first suction unit, wherein a controller controls the printing operation for a first substrate, the first suction operation for the second head or the printing operation for a second substrate, and the first suction operation for the first head to be sequentially performed.
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公开(公告)号:US20220339922A1
公开(公告)日:2022-10-27
申请号:US17675520
申请日:2022-02-18
Applicant: STI CO., LTD.
Inventor: Eun Su JEON , Kyu Yong HAN , Sang Pil PARK , Jae Hwan KIM
Abstract: Disclosed is a lamination system. A lamination system, which bonds a panel and a bonding target panel to from a panel assembly, according to one embodiment of the present invention may include a transfer which moves along a transfer shuttle and supports any one among the panel, the bonding target panel, and the panel assembly, a bonding chamber which is provided parallel to the transfer shuttle and bonds the panel and the bonding target panel, and a first robot which transfers any one among the panel, the bonding target panel, and the panel assembly between the transfer and the bonding chamber.
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公开(公告)号:US20230029555A1
公开(公告)日:2023-02-02
申请号:US17861935
申请日:2022-07-11
Applicant: STI CO., LTD.
Inventor: Dae Il YOU , Eun Su JEON , Sang Pil PARK , Kyu Yong HAN
Abstract: Disclosed are an adhesive layer forming apparatus and a display device manufacturing system including the same. The adhesive layer forming apparatus includes a first support chuck configured to move a first panel along a panel movement path in a first direction, a second support chuck provided side by side with the first support chuck in a second direction orthogonal to the first direction and configured to move a second panel along a panel movement path, and a first gantry configured to move a first head, which faces the first support chuck and the second support chuck, in the second direction on the first support chuck and the second support chuck and forms an adhesive layer on any one of the first panel and the second panel by jetting.
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公开(公告)号:US20220288932A1
公开(公告)日:2022-09-15
申请号:US17675484
申请日:2022-02-18
Applicant: STI CO., LTD.
Inventor: Kyu Yong HAN , Myeong Jin KIM
IPC: B41J2/14
Abstract: Disclosed is an inkjet head and a method of ejecting an ink using the same. An inkjet head according to one embodiment of the present invention may include nozzles each including a ejecting hole through which a solution including a light-emitting element is ejected and pairs of electrodes which are provided around the ejecting holes to face each other and which apply an electrode voltage to the light-emitting element.
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