公开(公告)号：US11158556B2

公开(公告)日：2021-10-26

申请号：US16552464

申请日：2019-08-27

Applicant: STMICROELECTRONICS (TOURS) SAS

Inventor： Olivier Ory ,  Romain Jaillet

IPC: H01L23/31 ,  H01L21/78 ,  H01L21/56 ,  H01L29/861

Abstract: The invention concerns a device comprising a support, an electrically-conductive layer covering the support, a semiconductor substrate on the conductive layer, and an insulating casing.

公开(公告)号：US11784104B2

公开(公告)日：2023-10-10

申请号：US17491189

申请日：2021-09-30

Applicant: STMICROELECTRONICS (TOURS) SAS

Inventor： Olivier Ory ,  Romain Jaillet

IPC: H01L21/56 ,  H01L23/31 ,  H01L21/78 ,  H01L29/861

CPC classification number: H01L23/3114 ,  H01L21/561 ,  H01L21/78 ,  H01L29/861

Abstract: The invention concerns a device comprising a support, an electrically-conductive layer covering the support, a semiconductor substrate on the conductive layer, and an insulating casing.