公开(公告)号：US11305534B2

公开(公告)日：2022-04-19

申请号：US16945465

申请日：2020-07-31

Applicant: STMICROELECTRONICS INTERNATIONAL N.V.

Inventor： Simon Dodd ,  David S. Hunt ,  Joseph Edward Scheffelin ,  Dana Gruenbacher ,  Stefan H. Hollinger ,  Uwe Schober ,  Peter Janouch

IPC: B41J2/14 ,  B41J2/175

Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.

公开(公告)号：US09968700B2

公开(公告)日：2018-05-15

申请号：US14975200

申请日：2015-12-18

Applicant: STMicroelectronics, Inc. ,  STMicroelectronics S.r.l. ,  STMicroelectronics International N.V.

Inventor： Simon Dodd ,  Joseph Edward Scheffelin ,  Dave S. Hunt ,  Timothy James Hoekstra ,  Faiz Sherman ,  Stephan Gary Bush

IPC: A61L9/03 ,  B05B17/06 ,  A61L2/00 ,  A61L9/00

CPC classification number: A61L9/03 ,  A61L2/00 ,  A61L9/00 ,  B05B17/0684

Abstract: One or more embodiments are directed to a microfluidic delivery system that dispenses a fluid. The microfluidic delivery system may be provided in a variety of orientations. In one embodiment, the microfluidic delivery system is vertical so that fluid being expelled opposes gravity. In another embodiment, the microfluidic delivery system is orientated sideways so that fluid being expelled has a horizontal component. In yet another embodiment, the microfluidic delivery system faces downward.

公开(公告)号：US10759168B2

公开(公告)日：2020-09-01

申请号：US16357077

申请日：2019-03-18

Applicant: STMICROELECTRONICS, INC. ,  STMICROELECTRONICS INTERNATIONAL N.V. ,  STMICROELECTRONICS S.R.L.

Inventor： Simon Dodd ,  David S. Hunt ,  Joseph Edward Scheffelin ,  Dana Gruenbacher ,  Stefan H. Hollinger ,  Uwe Schober ,  Peter Janouch

IPC: B41J2/14 ,  B41J2/175

Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.

公开(公告)号：US10272684B2

公开(公告)日：2019-04-30

申请号：US15253601

申请日：2016-08-31

Applicant: STMICROELECTRONICS, INC. ,  STMICROELECTRONICS INTERNATIONAL N.V. ,  STMICROELECTRONICS S.R.L.

Inventor： Simon Dodd ,  David S. Hunt ,  Joseph Edward Scheffelin ,  Dana Gruenbacher ,  Stefan H. Hollinger ,  Uwe Schober ,  Peter Janouch

IPC: B41J2/14 ,  B41J2/175

Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.