公开(公告)号：US20170278885A1

公开(公告)日：2017-09-28

申请号：US15619649

申请日：2017-06-12

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jean-Michel GREBET ,  Wee Chin Judy LIM

IPC: H01L27/146 ,  H01L31/0203

CPC classification number: H01L27/14618 ,  H01L27/14636 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/00014

Abstract: An image sensing device includes an interconnect layer and a number of grid array contacts arranged on a bottom side of the interconnect layer. An image sensor integrated circuit (IC) is carried by the interconnect layer and has an image sensing surface. A number of electrical connections are coupled between the image sensor IC and an upper side of the interconnect layer. A transparent plate overlies the image sensing surface of the image sensor IC. A cap is carried by the interconnect layer and has an opening overlying transparent plate and the image sensing surface. The cap has an upper wall spaced above the interconnect layer and the image sensor IC to define an internal cavity and the cap defines an air vent coupled to the internal cavity.

公开(公告)号：US20160190192A1

公开(公告)日：2016-06-30

申请号：US14582758

申请日：2014-12-24

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jean-Michel GREBET ,  Wee Chin Judy LIM

IPC: H01L27/146 ,  G02B5/20 ,  H04N5/225

CPC classification number: H01L27/14625 ,  G02B5/208 ,  H01L27/14618 ,  H01L2224/16225 ,  H04N5/2253

Abstract: One or more embodiments disclosed herein are directed to a chip scale package camera module that includes a glass interposer between a lens and an image sensor. In some embodiments, the glass interposer is made from one or more layers of optical quality glass and includes an infrared filter coating. The glass interposer also includes electrically conductive paths to connect the image sensor, mounted on one side of the glass interposer, with other components such as capacitors, which may be mounted on a different side of the glass interposer, and the rest of the camera system. The conductive layers include traces and vias that are formed in the glass interposer in areas away from the path of light in the camera module, such that the traces and vias do not block the light between the lens and the image sensor.

Abstract translation: 本文公开的一个或多个实施例涉及一种芯片级封装相机模块，其包括在透镜和图像传感器之间的玻璃插入器。 在一些实施例中，玻璃插入件由一层或多层光学质量玻璃制成并且包括红外滤光器涂层。 玻璃插入件还包括用于将安装在玻璃插入件的一侧上的图像传感器与可以安装在玻璃插入件的不同侧上的诸如电容器的其它部件连接的导电路径，以及相机系统的其余部分 。 导电层包括在相机模块中远离光路的区域中形成在玻璃插入件中的迹线和通孔，使得迹线和通孔不会阻挡透镜和图像传感器之间的光。

公开(公告)号：US20160181299A1

公开(公告)日：2016-06-23

申请号：US14578718

申请日：2014-12-22

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jean-Michel GREBET ,  Wee Chin Judy LIM

IPC: H01L27/146 ,  H01L31/02 ,  H01L31/0203

CPC classification number: H01L27/14618 ,  H01L27/14636 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/00014

Abstract: An image sensing device may include an interconnect layer and grid array contacts carried by the interconnect layer, and an image sensor IC carried by the interconnect layer and coupled to the grid array contacts, the image sensor IC having an image sensing surface. The image sensing device may include a transparent plate carried by the image sensor IC and aligned with the image sensing surface, and a cap carried by the interconnect layer and having an opening aligned with the image sensing surface. The cap may have an upper wall spaced above the interconnect layer and the image sensor IC to define an internal cavity, and the cap may define an air vent coupled to the internal cavity.

Abstract translation: 图像感测装置可以包括由互连层承载的互连层和栅极阵列触点，以及由互连层承载并耦合到栅极阵列触点的图像传感器IC，图像传感器IC具有图像感测表面。 图像感测装置可以包括由图像传感器IC携带并与图像感测表面对准的透明板，以及由互连层承载并具有与图像感测表面对准的开口的盖。 盖可以具有在互连层上方间隔开的上壁和图像传感器IC以限定内部空腔，并且帽可以限定联接到内部空腔的通风口。