公开(公告)号：US20230080594A1

公开(公告)日：2023-03-16

申请号：US17933016

申请日：2022-09-16

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Michele CALABRETTA ,  Crocifisso Marco Antonio RENNA ,  Sebastiano RUSSO ,  Marco Alfio TORRISI

IPC: H01L23/00 ,  B23K35/26 ,  C22C13/00 ,  H01L23/31 ,  H01L23/495

Abstract: A method for soldering a die obtained using the semiconductor technique with a leadframe, comprising the steps of providing a leadframe, which has at least one surface made at least partially of copper; providing a die, which has at least one surface coated with a metal layer; applying to the surface a solder alloy comprising at least 40 wt % of tin or at least 50% of indium or at least 50% of gallium, without lead, and heating the alloy to a temperature of at least 380° C. to form a drop of solder alloy; providing a die, which has at least one surface coated with a metal layer; and setting the metal layer in contact with the drop of solder alloy to form the soldered connection with the leadframe. Moreover, a device obtained with said method is provided.

公开(公告)号：US20200294950A1

公开(公告)日：2020-09-17

申请号：US16811964

申请日：2020-03-06

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Michele CALABRETTA ,  Crocifisso Marco Antonio RENNA ,  Sebastiano RUSSO ,  Marco Alfio TORRISI

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/31 ,  C22C13/00 ,  B23K35/26

Abstract: A method for soldering a die obtained using the semiconductor technique with a leadframe, comprising the steps of providing a leadframe, which has at least one surface made at least partially of copper; providing a die, which has at least one surface coated with a metal layer; applying to the surface a solder alloy comprising at least 40 wt % of tin or at least 50% of indium or at least 50% of gallium, without lead, and heating the alloy to a temperature of at least 380° C. to form a drop of solder alloy; providing a die, which has at least one surface coated with a metal layer; and setting the metal layer in contact with the drop of solder alloy to form the soldered connection with the leadframe. Moreover, a device obtained with said method is provided.