-
公开(公告)号:US20200152572A1
公开(公告)日:2020-05-14
申请号:US16676371
申请日:2019-11-06
Applicant: STMICROELECTRONICS S.R.L.
Inventor: Santo Alessandro SMERZI , Maria Concetta NICOTRA , Ferdinando IUCOLANO
IPC: H01L23/528 , H01L23/522
Abstract: An electronic device, comprising plurality of source metal strips in a first metal level; a plurality of drain metal strips in the first metal level; a source metal bus in a second metal level above the first metal level; a drain metal bus, in the second metal level; a source pad, coupled to the source metal bus; and a drain pad, coupled to the drain metal bus. The source metal bus includes subregions shaped in such a way that, in top-plan view, each of them has a width which decreases moving away from the first conductive pad; the drain metal bus includes subregions shaped in such a way that, in top-plan view, each of them has a width which decreases moving away from the second conductive pad. The first and second subregions are interdigitated.
-
公开(公告)号:US20240162153A1
公开(公告)日:2024-05-16
申请号:US18509052
申请日:2023-11-14
Applicant: STMICROELECTRONICS S.R.L.
Inventor: Santo Alessandro SMERZI , Maria Concetta NICOTRA , Ferdinando IUCOLANO
IPC: H01L23/528 , H01L23/522
CPC classification number: H01L23/5286 , H01L23/5226 , H01L29/2003
Abstract: An electronic device, comprising plurality of source metal strips in a first metal level; a plurality of drain metal strips in the first metal level; a source metal bus in a second metal level above the first metal level; a drain metal bus, in the second metal level; a source pad, coupled to the source metal bus; and a drain pad, coupled to the drain metal bus. The source metal bus includes subregions shaped in such a way that, in top-plan view, each of them has a width which decreases moving away from the first conductive pad; the drain metal bus includes subregions shaped in such a way that, in top-plan view, each of them has a width which decreases moving away from the second conductive pad. The first and second subregions are interdigitated.
-