公开(公告)号：US11622183B2

公开(公告)日：2023-04-04

申请号：US17204613

申请日：2021-03-17

Applicant: STMICROELECTRONICS S.R.L. ,  STMICROELECTRONICS (MALTA) LTD

Inventor： Roberto Brioschi ,  Paul Anthony Barbara

IPC: H04R1/04 ,  B81B7/00 ,  H04R19/00 ,  H04R19/04 ,  H04R31/00 ,  H04R1/06

Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.

公开(公告)号：US11032629B2

公开(公告)日：2021-06-08

申请号：US16235927

申请日：2018-12-28

Applicant: STMICROELECTRONICS S.R.L. ,  STMICROELECTRONICS (MALTA) LTD

Inventor： Roberto Brioschi ,  Paul Anthony Barbara

IPC: H01L21/00 ,  H04R1/04 ,  B81B7/00 ,  H04R19/00 ,  H04R19/04 ,  H04R31/00 ,  H04R1/06

Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.

公开(公告)号：US10225635B2

公开(公告)日：2019-03-05

申请号：US15143207

申请日：2016-04-29

Applicant: STMICROELECTRONICS S.R.L. ,  STMICROELECTRONICS (MALTA) LTD

Inventor： Roberto Brioschi ,  Alex Gritti ,  Kevin Formosa ,  Paul Anthony Barbara

IPC: H01L27/14 ,  H04R1/04 ,  B81B7/00 ,  H04R19/00 ,  H04R19/04 ,  H04R1/06 ,  H04R31/00

Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.