公开(公告)号：US10033464B2

公开(公告)日：2018-07-24

申请号：US14282394

申请日：2014-05-20

Applicant: STMICROELECTRONICS S.r.I.

Inventor： Luca Maggi ,  Antonio Fincato ,  Salvatore Mario Rotolo ,  Matteo Alessio Traldi ,  Luigi Verga ,  Mark Andrew Shaw

IPC: H04B10/00 ,  H04B13/02 ,  H04B10/40 ,  G02B6/42 ,  H04B10/2575

Abstract: An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface.