公开(公告)号：US10033464B2

公开(公告)日：2018-07-24

申请号：US14282394

申请日：2014-05-20

Applicant: STMICROELECTRONICS S.r.I.

Inventor： Luca Maggi ,  Antonio Fincato ,  Salvatore Mario Rotolo ,  Matteo Alessio Traldi ,  Luigi Verga ,  Mark Andrew Shaw

IPC: H04B10/00 ,  H04B13/02 ,  H04B10/40 ,  G02B6/42 ,  H04B10/2575

Abstract: An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface.

公开(公告)号：US20140291781A1

公开(公告)日：2014-10-02

申请号：US14224861

申请日：2014-03-25

Applicant: STMicroelectronics S.r.I.

Inventor： Mark Andrew Shaw ,  Fabrizio Soglio

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0032 ,  B81C1/00261 ,  H01L29/84 ,  H04R19/005 ,  H04R19/02 ,  H04R31/00

Abstract: A packaged MEMS transducer device comprising: a die, including: a semiconductor body having a front side and a back side, opposite to one another in a first direction, at least one cavity extending through the semiconductor body between the front side and the back side, and at least one membrane extending on the front side at least partially suspended over the cavity; and a package designed to house the die on an inner surface thereof. The transducer device moreover includes a sealing layer extending on the back side of the semiconductor body for sealing the cavity, and includes a paste layer extending between the sealing layer and the inner surface of the package for firmly coupling the die to the package.

Abstract translation: 一种封装的MEMS换能器装置，包括：模具，包括：半导体本体，其具有在第一方向上彼此相对的前侧和后侧，至少一个在前侧和后侧之间延伸穿过半导体本体的空腔 并且至少一个膜在前侧延伸至少部分地悬挂在空腔上; 以及设计成在其内表面上容纳模具的包装。 换能器装置还包括在半导体本体的后侧延伸的密封层，用于密封空腔，并且包括在密封层和封装的内表面之间延伸的糊层，用于将管芯牢固地连接到封装。

公开(公告)号：US08759149B2

公开(公告)日：2014-06-24

申请号：US14029437

申请日：2013-09-17

Applicant: STMicroelectronics S.r.I.

Inventor： Mark Andrew Shaw ,  Gianmarco Antonio Camillo

IPC: H01L21/00 ,  B81B7/00

CPC classification number: B81B7/0064 ,  B81B2201/0257 ,  B81C1/00333 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48464 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An encapsulated micro-electro-mechanical device, wherein a MEMS chip is encapsulated by a package formed by a first, a second, and a third substrates that are bonded together. The first substrate has a main surface bearing the MEMS chip, the second substrate is bonded to the first substrate and defines a chamber surrounding the MEMS chip, and the third substrate is bonded to the second substrate and upwardly closes the chamber. A grid or mesh structure of electrically conductive material is formed in or on the third substrate and overlies the MEMS chip; the second substrate has a conductive connection structure coating the walls of the chamber, and the first substrate incorporates an electrically conductive region, which forms, together with the conductive layer and the grid or mesh structure, a Faraday cage.

Abstract translation: 一种封装的微机电装置，其中MEMS芯片由通过第一，第二和第三基板形成的封装封装，所述第一，第二和第三基板被结合在一起。 第一基板具有承载MEMS芯片的主表面，第二基板结合到第一基板并且限定围绕MEMS芯片的腔室，并且第三基板结合到第二基板并向上关闭腔室。 在第三衬底中或第三衬底上形成导电材料的栅格或网状结构，并覆盖在MEMS芯片上; 第二基板具有涂覆室的壁的导电连接结构，并且第一基板包括与导电层和网格或网状结构一起形成法拉第笼的导电区域。